Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Stage 2 Summary<br />
‣Contact Resistance<br />
Experimental Detail / Analysis<br />
‣ Initial read<strong>in</strong>gs consistent with<br />
expectations<br />
‣ Stacked up resistances identified<br />
‣ Resistance of 0.5mm spr<strong>in</strong>g contact<br />
significantly higher than 1.0mm and<br />
0.8mm<br />
Device<br />
<strong>Socket</strong><br />
<strong>Test</strong> Card<br />
Internal to<br />
Device<br />
<strong>Socket</strong>/Contact<br />
P<strong>in</strong> to P<strong>in</strong><br />
<strong>Test</strong> Po<strong>in</strong>t<br />
Trace<br />
Stacked Resistance<br />
Resistance (ohms)<br />
8<br />
7<br />
6<br />
5<br />
4<br />
3<br />
2<br />
1<br />
0<br />
1.0mm 0.8mm 0.5mm 1.0mm 0.8mm 0.5mm<br />
2 Ball Cha<strong>in</strong>s 20 Ball Cha<strong>in</strong>s<br />
Sample Type<br />
Internal to Device<br />
<strong>Socket</strong> / Contact<br />
P<strong>in</strong> to P<strong>in</strong> Trace<br />
<strong>Test</strong> Po<strong>in</strong>t Trace<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 10
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