Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Experimental Detail / Analysis<br />
Stage 3 Summary (cont.)<br />
‣ Ball Hardness (Room Temp)<br />
‣ No significant difference due<br />
to:<br />
‣ Ball diameter (1.0mm and<br />
0.8mm pitch)<br />
‣ Pb and No Pb samples<br />
‣ Solder Transfer / Migration<br />
‣ Solder transfer observed on<br />
several samples.<br />
‣ M<strong>in</strong>imal <strong>in</strong>itial evidence of<br />
migration <strong>in</strong> Au or PdNi<br />
contacts at T504 (Cont<strong>in</strong>u<strong>in</strong>g<br />
analysis of migration at this<br />
time).<br />
Force (grams)<br />
35.00<br />
30.00<br />
25.00<br />
20.00<br />
15.00<br />
10.00<br />
5.00<br />
0.00<br />
NoPb<br />
0.8mm<br />
Ball Hardness<br />
Pb<br />
1.0mm 0.8mm<br />
Pitch<br />
1.0mm<br />
Examples of Solder transfer to spoon contact<br />
Range<br />
Average<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 19
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