Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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<strong>Test</strong> Methods<br />
‣Packages<br />
‣ 208 BGA 17x17mm 1.0mm<br />
‣ 225 PBGA 13x13mm 0.8mm<br />
‣ 244 PBGA 12x12mm 0.5mm<br />
‣Daisy Cha<strong>in</strong> Structures<br />
‣ 4 cha<strong>in</strong>s 2 ball W/ bias<br />
Overview of Experiment<br />
225 I/O MAP PBGA,<br />
13x13 PKG, 0.8 MM Pitch<br />
JP15<br />
JP16<br />
R16<br />
R15<br />
JP14<br />
R14<br />
JP13<br />
R13<br />
1<br />
A<br />
B<br />
C<br />
D<br />
E<br />
F<br />
G<br />
H<br />
J<br />
K<br />
L<br />
M<br />
N<br />
P<br />
R<br />
R1<br />
JP1<br />
JP2<br />
R2<br />
X<br />
DR1<br />
R3<br />
R4<br />
JP4<br />
JP3<br />
2 3 4 5 6 7 8 9 10 11 12 13 14 15<br />
R5<br />
JP5<br />
JP6<br />
R6<br />
R7<br />
R8<br />
JP8<br />
JP7<br />
‣ 4 cha<strong>in</strong>s 2 ball non-biased<br />
‣ 4 cha<strong>in</strong>s 20 ball W/ Bias<br />
JP11<br />
JP12<br />
R12<br />
R11<br />
DR2<br />
X<br />
R10<br />
JP10<br />
JP9<br />
R9<br />
‣ 4 cha<strong>in</strong>s 20 ball non-biased<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 6
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