Burn-in & Test Socket Workshop - BiTS Workshop

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Experimental Detail / Analysis Stage 3 - Summary ‣ Contact Resistance ‣ Changes clearly identifiable ‣ Trends consistent on long/short chains ‣ Increases with and without bias over time in all cases ‣ No significant difference between: ‣ 0.8 mm and 1.0 mm sample trends ‣ Pb and No Pb samples ‣ Bias and No Bias chains ‣ Au and PdNi ‣ NiBn overall highly variable, high contact resistance ‣ Resistance increased much quicker for controls (room temperature) ‣ Scrubbing devices (actuation of socket or changing devices) most effective at reducing contact resistance for both Pb and No Pb samples Log Resistance (O) Log Resistance (O) 100 100 Contact Resistance (20 ball) - 0.8mm The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 14 10 1 0 10 1 0 Contact Resistance (20 ball) - 1.0 mm No Pb 0 24 72 168 504 0 24 72 168 504 No Pb Au Au W/ Bias 0 24 72 168 504 0 24 72 168 504 Au Au W/ Bias Pb NiBn NiBn W/ Bias Pb NiBn NiBn W/ Bias PdNi PdNi W/ Bias PdNi PdNi W/ Bias
Experimental Detail / Analysis Stage 3 Summary ‣ Burn-in Monitoring ‣ Two 20 ball chains monitored real time for duration of test, no clear pattern with socket type or plating ‣ High resistance readings at room temp did not correlate to opens under Burn-in conditions ‣ Very small percentage of opens reported overall during Burnin monitoring Open at room temp Contact Resistance (ohms) 100 80 60 40 20 0 Monitored Failures and Contact Resistance for Failures by Sample 0 0 5 10 15 20 25 30 35 Sample # 100 80 60 40 20 Failure Time (%) Contact Resistance % Time Failing The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 15
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Burn-in & Test Socket Workshop Marc
Page 3 and 4:
Burn-in & Test Socket Workshop Sess
Page 5 and 6:
Objectives • Determine impact of
Page 7 and 8:
Pb free - Background • Why Pb fre
Page 9 and 10:
Typical Test Setup • Pneumatic co
Page 11 and 12:
PBGA Test Socket Resistance at Cycl
Page 13 and 14:
CBGA Test Socket Resistance • Dai
Page 15 and 16:
CBGA Test Damage 90/10 Leadfree Wit
Page 17 and 18:
CCGA Contact Resistance Average Res
Page 19 and 20:
PBGA Contactor Resistance at Burnin
Page 21 and 22:
Ball Damage 1.00mm Pitch Contactor
Page 23 and 24: PBGA Contactor Resistance at Burnin
Page 25 and 26: PBGA Contactor Cleaning • Surface
Page 27 and 28: Pb Free Early Learning Summary Con
Page 29 and 30: Up Front Concerns with Lead-Free So
Page 31 and 32: Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35 and 36: Test Objective • Metallurgical Pl
Page 37 and 38: Metallurgical Plating Test • Test
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54: Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56: 90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58: Resistance in Ohmsa 0.03 0.025 0.02
Page 59 and 60: Conclusion • Changes made to cont
Page 61 and 62: The Effects of No Lead Solder Balls
Page 63 and 64: What we asked… Experimental Objec
Page 65 and 66: Evaluation Criteria Overview of Exp
Page 67 and 68: Overview of Experiment Test Methods
Page 69 and 70: Stage 2 Objective Experimental Deta
Page 71 and 72: Experimental Detail / Analysis Stag
Page 73: Experimental Detail / Analysis Stag
Page 85 and 86: • General Observations Summary of
Page 87 and 88: Conclusions • Overall performance
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Burn-in & Test Socket Workshop - BiTS Workshop

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