Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Experimental Detail / Analysis<br />
Stage 3 - Summary<br />
‣ Contact Resistance<br />
‣ Changes clearly identifiable<br />
‣ Trends consistent on long/short<br />
cha<strong>in</strong>s<br />
‣ Increases with and without bias over<br />
time <strong>in</strong> all cases<br />
‣ No significant difference between:<br />
‣ 0.8 mm and 1.0 mm sample trends<br />
‣ Pb and No Pb samples<br />
‣ Bias and No Bias cha<strong>in</strong>s<br />
‣ Au and PdNi<br />
‣ NiBn overall highly variable, high<br />
contact resistance<br />
‣ Resistance <strong>in</strong>creased much quicker for<br />
controls (room temperature)<br />
‣ Scrubb<strong>in</strong>g devices (actuation of socket<br />
or chang<strong>in</strong>g devices) most effective at<br />
reduc<strong>in</strong>g contact resistance for both<br />
Pb and No Pb samples<br />
Log Resistance (O)<br />
Log Resistance (O)<br />
100<br />
100<br />
Contact Resistance (20 ball) - 0.8mm<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 14<br />
10<br />
1<br />
0<br />
10<br />
1<br />
0<br />
Contact Resistance (20 ball) - 1.0 mm<br />
No Pb<br />
0 24 72 168 504 0 24 72 168 504<br />
No Pb<br />
Au<br />
Au W/ Bias<br />
0 24 72 168 504 0 24 72 168 504<br />
Au<br />
Au W/ Bias<br />
Pb<br />
NiBn<br />
NiBn W/ Bias<br />
Pb<br />
NiBn<br />
NiBn W/ Bias<br />
PdNi<br />
PdNi W/ Bias<br />
PdNi<br />
PdNi W/ Bias
Change language