Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Experimental Detail / Analysis<br />
Stage 1 Observations<br />
‣ Contact resistance after 0<br />
cycles and 1000 cycles taken<br />
with same device<br />
‣ Without bias or exposure to<br />
temp, contact resistance<br />
<strong>in</strong>creased <strong>in</strong> most cases after<br />
durability test<strong>in</strong>g<br />
‣ Difference <strong>in</strong> behavior may be<br />
attributed to wipe and depth of<br />
penetration<br />
Log Resistance (mO)<br />
Log Resistance (mO)<br />
Log Resistance (mO)<br />
10000<br />
1000<br />
100<br />
10000<br />
1000<br />
100<br />
10000<br />
1000<br />
100<br />
Contact resistance - 0.5mm<br />
NoPb<br />
NoPb<br />
Pb<br />
0 1000 0 1000<br />
Stress Cycles<br />
Contact resistance - 0.8mm<br />
Pb<br />
0 1000 0 1000<br />
Stress Cycles<br />
Contact resistance – 1.0mm<br />
NoPb<br />
0<br />
Pb<br />
1000 0 1000<br />
Stress Cycles<br />
Au<br />
NiBn<br />
PdNi<br />
Au<br />
NiBn<br />
PdNi<br />
Au<br />
NiBn<br />
PdNi<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 8
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