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Burn-in & Test Socket Workshop - BiTS Workshop

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What we asked…<br />

Experimental Objectives<br />

How Do These:<br />

Ball Composition<br />

Contact Plat<strong>in</strong>g<br />

Contact Force<br />

Current<br />

Temperature<br />

Time<br />

Contact Types<br />

?<br />

Influence These:<br />

Contact Resistance<br />

Ball Stick<strong>in</strong>g<br />

Witness Marks<br />

Ball Hardness<br />

Solder Transfer /<br />

Migration<br />

Ball Deformation<br />

By exam<strong>in</strong><strong>in</strong>g the performance of different socket<br />

types and plat<strong>in</strong>g on Pb and No Pb solder balls,<br />

what can we learn?<br />

The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 3

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