Burn-in & Test Socket Workshop - BiTS Workshop

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Experimental Detail / Analysis Stage 2 Summary ‣ Witness Marks ‣ Witness marks clearly visible on all contact types ‣ Surface area of witness mark used as criteria ‣ Current Capability, Device Temperature ‣ Temperature characterization established operating parameters for subsequent stages ‣ 50 mA did not significantly increase device temperature 0.8mm pinch witness marks 1.0mm spoon witness marks The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 12
Experimental Detail / Analysis Stage 3 Objective ‣ Evaluate time, temperature and bias in a typical qualification / production burn-in environment Coplanarity Contact Resistance Burn-in (Contact Resistance readings at 24,72,168,504 Hrs.) ‣ Parameters ‣ Single device for entire test duration in each socket sample ‣ Controls maintained (at room temp) Witness Marks Ball Sticking Ball Hardness Ball Deformation Solder Transfer / Migration Cross Section Solder Ball Contact Type Plating Type Temp °C Force Current Time (Hrs.) Pb Spoon (1.0mm) Au 35 100% 0 mA 0 No Pb Pinch (0.8mm) PdNi 100 125% 50 mA 24 Spring (0.5mm) Crown NiBn 125 72 Spring (0.5mm) V-Groove 150 168 504 The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 13
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Burn-in & Test Socket Workshop Marc
Page 3 and 4:
Burn-in & Test Socket Workshop Sess
Page 5 and 6:
Objectives • Determine impact of
Page 7 and 8:
Pb free - Background • Why Pb fre
Page 9 and 10:
Typical Test Setup • Pneumatic co
Page 11 and 12:
PBGA Test Socket Resistance at Cycl
Page 13 and 14:
CBGA Test Socket Resistance • Dai
Page 15 and 16:
CBGA Test Damage 90/10 Leadfree Wit
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CCGA Contact Resistance Average Res
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PBGA Contactor Resistance at Burnin
Page 21 and 22: Ball Damage 1.00mm Pitch Contactor
Page 23 and 24: PBGA Contactor Resistance at Burnin
Page 25 and 26: PBGA Contactor Cleaning • Surface
Page 27 and 28: Pb Free Early Learning Summary Con
Page 29 and 30: Up Front Concerns with Lead-Free So
Page 31 and 32: Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35 and 36: Test Objective • Metallurgical Pl
Page 37 and 38: Metallurgical Plating Test • Test
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54: Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56: 90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58: Resistance in Ohmsa 0.03 0.025 0.02
Page 59 and 60: Conclusion • Changes made to cont
Page 61 and 62: The Effects of No Lead Solder Balls
Page 63 and 64: What we asked… Experimental Objec
Page 65 and 66: Evaluation Criteria Overview of Exp
Page 67 and 68: Overview of Experiment Test Methods
Page 69 and 70: Stage 2 Objective Experimental Deta
Page 71: Experimental Detail / Analysis Stag
Page 75 and 76: Experimental Detail / Analysis Stag
Page 85 and 86: • General Observations Summary of
Page 87 and 88: Conclusions • Overall performance
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