Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Experimental Detail / Analysis<br />
Stage 3 Objective<br />
‣ Evaluate time, temperature and bias<br />
<strong>in</strong> a typical qualification / production<br />
burn-<strong>in</strong> environment<br />
Coplanarity<br />
Contact<br />
Resistance<br />
<strong>Burn</strong>-<strong>in</strong><br />
(Contact Resistance read<strong>in</strong>gs at<br />
24,72,168,504 Hrs.)<br />
‣ Parameters<br />
‣ S<strong>in</strong>gle device for entire test duration<br />
<strong>in</strong> each socket sample<br />
‣ Controls ma<strong>in</strong>ta<strong>in</strong>ed (at room temp)<br />
Witness<br />
Marks<br />
Ball Stick<strong>in</strong>g<br />
Ball<br />
Hardness<br />
Ball<br />
Deformation<br />
Solder<br />
Transfer /<br />
Migration<br />
Cross<br />
Section<br />
Solder Ball<br />
Contact<br />
Type<br />
Plat<strong>in</strong>g<br />
Type<br />
Temp<br />
°C<br />
Force<br />
Current<br />
Time<br />
(Hrs.)<br />
Pb<br />
Spoon (1.0mm)<br />
Au<br />
35<br />
100%<br />
0 mA<br />
0<br />
No Pb<br />
P<strong>in</strong>ch (0.8mm)<br />
PdNi<br />
100<br />
125%<br />
50 mA<br />
24<br />
Spr<strong>in</strong>g (0.5mm) Crown<br />
NiBn<br />
125<br />
72<br />
Spr<strong>in</strong>g (0.5mm) V-Groove<br />
150<br />
168<br />
504<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 13
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