Burn-in & Test Socket Workshop - BiTS Workshop

More documents

Recommendations

Info

General Observations Summary of Observations ‣ Contact resistance for Pb and No Pb similar at room ‣ Contact resistance for Au and PdNi similar for Pb and No Pb ‣ Contact resistance for 125% force appears to decrease over time on Au and PdNi ‣ Ball sticking worse on No Pb than on Pb for 1.0mm and 0.8mm ‣ Ball sticking on 0.5mm with Au worst on Pb (also largest witness marks) ‣ Ball sticking increases over time at temperature The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 24
• General Observations Summary of Observations ‣ Ball deformation (coplanarity and diameter) were not impacted in this experiment ‣ Ball hardness similar for Pb and No Pb at room temperature ‣ Witness marks on Pb larger than on No Pb (Pb balls soften at temperature) ‣ Witness marks largest on 0.5mm contacts, followed by 1.0mm, then 0.8mm ‣ Solder transfer evident on Pb and No Pb samples on all Au and PdNi contact types The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 25
Page 1 and 2:
Burn-in & Test Socket Workshop Marc
Page 3 and 4:
Burn-in & Test Socket Workshop Sess
Page 5 and 6:
Objectives • Determine impact of
Page 7 and 8:
Pb free - Background • Why Pb fre
Page 9 and 10:
Typical Test Setup • Pneumatic co
Page 11 and 12:
PBGA Test Socket Resistance at Cycl
Page 13 and 14:
CBGA Test Socket Resistance • Dai
Page 15 and 16:
CBGA Test Damage 90/10 Leadfree Wit
Page 17 and 18:
CCGA Contact Resistance Average Res
Page 19 and 20:
PBGA Contactor Resistance at Burnin
Page 21 and 22:
Ball Damage 1.00mm Pitch Contactor
Page 23 and 24:
PBGA Contactor Resistance at Burnin
Page 25 and 26:
PBGA Contactor Cleaning • Surface
Page 27 and 28:
Pb Free Early Learning Summary Con
Page 29 and 30:
Up Front Concerns with Lead-Free So
Page 31 and 32:
Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35 and 36: Test Objective • Metallurgical Pl
Page 37 and 38: Metallurgical Plating Test • Test
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54: Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56: 90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58: Resistance in Ohmsa 0.03 0.025 0.02
Page 59 and 60: Conclusion • Changes made to cont
Page 61 and 62: The Effects of No Lead Solder Balls
Page 63 and 64: What we asked… Experimental Objec
Page 65 and 66: Evaluation Criteria Overview of Exp
Page 67 and 68: Overview of Experiment Test Methods
Page 69 and 70: Stage 2 Objective Experimental Deta
Page 71 and 72: Experimental Detail / Analysis Stag
Page 83: Experimental Detail / Analysis Stag
Page 87 and 88: Conclusions • Overall performance
show all

Burn-in & Test Socket Workshop - BiTS Workshop

Create successful ePaper yourself

Delete template?

Save as template?