Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Experimental Detail / Analysis<br />
Stage 3 Summary (cont.)<br />
‣ Ball Deformation<br />
‣ No significant difference between<br />
Pb and NoPb for coplanarity and<br />
diameter pre and post stress<br />
‣ All devices well with<strong>in</strong> spec<br />
‣ 200 micron change allowed<br />
for diameter and coplanarity<br />
on 1.0mm<br />
‣ 100 micron change allowed<br />
for diameter and coplanarity<br />
on 0.8mm<br />
‣ Overall: M<strong>in</strong>imal impact after<br />
stress to both ball diameter and<br />
coplanarity<br />
Microns<br />
Microns<br />
200<br />
150<br />
100<br />
50<br />
0<br />
700<br />
600<br />
500<br />
400<br />
300<br />
NoPb<br />
Stress<br />
Average Coplanarity<br />
Pre<br />
Control<br />
Pb<br />
Post Pre Post<br />
Solder Ball / Time<br />
Ball Diameter<br />
Stress<br />
1.0mm<br />
0.8mm<br />
Control<br />
Stress<br />
Control<br />
Stress<br />
Control<br />
NoPb Pb NoPb Pb<br />
Pre Stress Post Stress<br />
0.8mm<br />
1.0mm<br />
Max<br />
M<strong>in</strong><br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 17