TPF-C Technology Plan - Exoplanet Exploration Program - NASA

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Chapter 3 Figure 3-5. Coronagraph system model with pupil plane and focal plane masks. Initial experiments at Princeton have yielded contrast in the 10 -7 scale at 632.8 nm in their lab. Further experiments with improved masks and testbed optics are expected to provide pathways to reach the final goals. Some of these masks will also be fabricated at JPL with precision e- beam lithography and tested in the HCIT at JPL. Silicon based masks: To take advantage of the advanced and mature technology of silicon processing and deep etching, masks based on silicon are also being considered as candidates for development. Proceedings of SPIE conference on Astronomical Telescopes and Instrumentation, 5487(63) pp.1312- 1321, 2004. 6 Vanderbei, R. J., Kasdin, N. J., Spergel, D. N., "Rectangular-Mask Coronagraphs for High-Contrast Imaging", The Astrophysical Journal, Vol. 615 pp. 555-561, November 1, 2004. 32
Optics and Starlight Suppression Technology 3.1.2 Technology Demonstration Mirror Objective The TDM is a 1.8-m mirror that will demonstrate mirror technology required for the primary mirror (PM). The static error budget for the entire system requires sub-nm wavefront quality, and the dynamic error budget is two orders of magnitude more stringent for TPF-C. For both static and dynamic errors the PM is expected to be the largest error contributor. Errors on the primary mirror must be within the capture range for the wavefront sensing and control system. Control of the deformable mirror is then relied upon to reduce the WFE to the required sub-nm level. The technology necessary to control these errors for the large TPF-C can be demonstrated on a 1.8m sub-scale mirror if it is a light-weighted, off-axis optic like the PM. For both the TDM and TPF- C static errors will be driven by the structural design, figuring and polishing techniques, coating process, and the sensitivity of the metrology to these errors. Dynamic errors like the static errors are driven primarily by the structural design but also by material characteristics and fabrication processes. Timing of the TDM is very important so that technology risks are reduced before the fabrication of the TPF-C PM. Due to the long lead time for fabrication of the PM, it must be procured early in the formulation phase if TPF-C is to meet its launch readiness date. TPF-C performance requires that mirror technology sufficient to achieve the required levels, as outlined in Table 3-1, is demonstrated early in the program. Table 3-1. TDM Performance Requirements Parameter Range Requirement Goal SURFACE ERROR REQUIREMENTS Low Spatial Frequency (LSF) 10 cycles/cm 10 Å rms 5 Å rms COATING RESIDUAL REFLECTANCE REQUIREMENTS Mid Spatial Frequency 0.025–0.5 cycles/cm
Page 1 and 2: JPL Publication 05-8 Technology Pla
Page 3: TECHNOLOGY PLAN TERRESTRIAL PLANET
Page 6 and 7: Recent Highlights Technical progres
Page 8 and 9: Figure i-4. Deformable mirror deliv
Page 10 and 11: Table of Contents Approvals........
Page 12 and 13: 7.5.2 Precision Hexapod............
Page 14 and 15: Chapter 1 Figure 1-1. Artist's impr
Page 16 and 17: Chapter 1 interferometry, continues
Page 18 and 19: Chapter 1 Back end coronagraph opti
Page 20 and 21: Chapter 1 Surrounding the whole tel
Page 22 and 23: Chapter 1 Pol. BS fold/steering Mic
Page 24 and 25: Chapter 1 1.6.5 Sunshield The teles
Page 26 and 27: Chapter 1 expected architecture dow
Page 28 and 29: Chapter 1 Table 1-3. TPF-C Technolo
Page 30 and 31: Chapter 1 3B: Demonstrate, using th
Page 32 and 33: Chapter 2 2 Error Budgets 2.1 Contr
Page 34 and 35: Chapter 2 Error Budget Validation G
Page 36 and 37: Chapter 2 Further, it is shown that
Page 38 and 39: Chapter 2 Table 2-1. Requirement on
Page 40 and 41: Chapter 3 3 Optics and Starlight Su
Page 42 and 43: Chapter 3 are in progress with cont
Page 46 and 47: Chapter 3 (though not light-weight
Page 48 and 49: Chapter 3 Table 3-3. ITT Metrology
Page 50 and 51: Chapter 3 observations. The time it
Page 52 and 53: Chapter 3 vacuum-compatible, low-po
Page 54 and 55: Chapter 3 blank size. Westerhoff et
Page 56 and 57: Chapter 3 configurations, performan
Page 58 and 59: Chapter 3 Figure 3-10: Plots showin
Page 60 and 61: Chapter 3 The wavefront quality of
Page 62 and 63: Chapter 3 Figure 3-13. Optical layo
Page 64 and 65: Chapter 3 algorithms have limitatio
Page 66 and 67: Chapter 3 simulated star source is
Page 68 and 69: Chapter 4 Figure 4-1. Overview of t
Page 70 and 71: Chapter 4 enclosures, and stable la
Page 72 and 73: Chapter 4 facilities from which dat
Page 74 and 75: Chapter 4 Figure 4-5. Microslip Tri
Page 76 and 77: Chapter 4 Figure 4-7. Calibration o
Page 78 and 79: Chapter 4 Figure 4-8. Comparison of
Page 80 and 81: Chapter 4 4.2 Subsystem and System
Page 82 and 83: Chapter 4 Figure 4-11. Schematic of
Page 84 and 85: Chapter 4 Figure 4-12. Fine guiding
Page 86 and 87: Chapter 4 (5) The Fine Steering Mir
Page 88 and 89: Chapter 4 Third, precise thermal co
Page 90 and 91: Chapter 4 giving confidence that fl
Page 92 and 93: Chapter 4 surface polish is nonethe
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Chapter 5 TPF-C is planning a suite
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Chapter 5 engineering judgment (i.e
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Chapter 5 categories, in reality ea
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Chapter 5 Table 5-3. Validation of
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Chapter 5 5.6.1 Modeling Methodolog
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Chapter 5 strength of computer simu
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Chapter 6 6 Instrument Technology a
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Chapter 6 Figure 6-1. Detailed conc
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Chapter 6 The first method is self-
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Chapter 6 super computers and is us
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Chapter 7 7 Plan for Technology Dev
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Chapter 7 Figure 7-1. TPF-C Technol
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Chapter 7 Improvements to the DM ov
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Chapter 7 7.3 Error Budgets 7.3.1 D
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Chapter 7 7.4 Optics and Starlight
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Chapter 7 7.4.2 Apodizing Masks and
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Chapter 7 7.4.4 Wavefront Sensing a
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Chapter 7 7.4.6 Transmissive Optics
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Chapter 7 7.4.8 Scatterometer Scope
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Chapter 7 7.5 Structural, Thermal,
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Chapter 7 7.5.3 Precision Structura
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Chapter 7 model of TPF-C and should
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Chapter 7 7.5.6 Secondary Mirror To
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Chapter 7 7.5.8 Sub-scale EM Sunshi
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Chapter 7 7.6 Integrated Modeling a
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Chapter 7 7.7.3 Advanced Concepts:
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Chapter 8 134
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Appendices Appendix B: TPF-C Detail
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Appendices Appendix D: TPF-C Techno
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Appendices Appendix F: Acronym List
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Appendices RWA SAO SBIR SIM SM SMFA
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TPF-C Technology Plan - Exoplanet Exploration Program - NASA

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