TPF-C Technology Plan - Exoplanet Exploration Program - NASA
TPF-C Technology Plan - Exoplanet Exploration Program - NASA
TPF-C Technology Plan - Exoplanet Exploration Program - NASA
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Chapter 3<br />
vacuum-compatible, low-power 64-channel multiplex switch ASIC has been developed at JPL to<br />
distribute the voltage settings while minimizing the number of control wires that must pass<br />
through the vacuum chamber wall.<br />
The products to be developed are 32 × 32, 48 × 48, 64 × 64, and 96 × 96 deformable mirrors<br />
leading toward technical hardware that are reliable, large enough, and robust enough to support<br />
flight performance levels required by Sept. 2008. Module development and combinations will<br />
enable a best understanding of last path for flight hardware development.<br />
In addition, Boston Micromachines is providing DMs for the GSFC Michaelson testbed,<br />
Princeton pupil plane testbed, and NOAO PIAA testbed with a similar architecture to the DMs<br />
required by HCIT. Boston Micromachines also provides the Visible Nuller (VN) with<br />
segmented DMs. The alternative approach and supplier represented by these MEMS DMs<br />
provide risk mitigation.<br />
Progress to Date<br />
Xinetics has delivered five 32 × 32 actuator DMs and two of four 64 × 64 actuator DMs. The 32<br />
× 32 DMs have been used in HCIT to achieve suppression approaching 10 -9 with speckle nulling.<br />
Work is currently progressing on the 48 × 48 DM 2,304 channel single module manufacturing<br />
pathfinders, including module development, actuator machining and delineation pathfinder,<br />
interconnect evolution pathfinders, and facesheet development.<br />
Table 3-4. Deformable Mirror Specifications<br />
Deformable Mirror<br />
Property<br />
Actuators across<br />
aperture<br />
State of the Art - State of the Art - Xinetics <strong>TPF</strong>-C Flight Baseline<br />
MEMS *<br />
32 actuators/pupil 64 actuators/pupil 96 actuators/pupil<br />
Actuator spacing 3.3 actuators/mm 1 actuator/mm ≥ 1 actuator/mm<br />
Command resolution ~5 Å surface/step † < 0.10 Å surface/step < 0.05 Å surface/step<br />
Actuator stroke ~20000 Å surface ‡ > 2000 Å surface > 2000 Å surface<br />
Actuator position<br />
stability<br />
Actuator thermal<br />
stability<br />
Mirror surface<br />
quality at<br />
uncontrollable<br />
spatial scales<br />
TBD<br />
< 0.20 Å surface/hour (includes<br />
effects of 10-mK thermal stability)<br />
TBD ~ 3.5% of stroke / K TBD<br />
~10 nm surface § < 10 Å surface TBD<br />
< 0.02 Å surface/hour<br />
* Based on Boston MicroMachines Devices<br />
† Command resolution is currently limited by the precision of the high voltage drivers with an average step size of ~10<br />
nm/V; with custom 16-bit electronics, an average 0.3 Å/step is expected. Current devices on order are expected to achieve<br />
up to 12-13 bit resolution or 4.9-2.4 Å/step.<br />
‡ Nominal actuator stroke is ~20,000 Å (2 μm), however usable stroke over full aperture is limited by unpowered, surface<br />
curvature to somewhat less than this.<br />
§ Small area, periodic deviations at actuator frequencies (2x outer working angle frequency) in unpolished devices. Devices<br />
on order are being polished to reduce this level.<br />
40