TPF-C Technology Plan - Exoplanet Exploration Program - NASA

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Recent Highlights Technical progress against the previous development plan (Technology Plan for the Terrestrial Planet Finder, March 2003) has been dramatic, particularly in the past year. The critical technologies for TPF-C have been identified as those required for starlight suppression in both narrow and broad bands. The primary testbed for demonstration in this area, the High Contrast Imaging Testbed (HCIT), had achieved a contrast of 10 -5 by March of 2003. As of December 2004, a contrast of 0.9 × 10 -9 , an improvement of better than 4 orders of magnitude, had been achieved with laser light as shown in Figure i-1. Broadband experiments have also begun during this interval, achieving a contrast of 5 × 10 -9 over a 40-nm bandpass. These contrast values refer to an average contrast within the half-dark hole extending from 4 to 10 λ/D. These achievements represent significant progress against the milestones agreed upon for entry into Phase A. Figure i-1. Laboratory results from the HCIT showing an average contrast of 0.9 × 10 -9 for laser light, as measured in the half dark hole (shown on a logarithmic scale in the upper-left corner) over angles from 4 to 10 λ/D. Progress in two component technologies was essential to achieving the performance the HCIT demonstrated. The first was the fabrication of gray scale masks consistent with the 10 -9 contrast achieved, and the second was continued development of the deformable mirrors (DMs). vi
Linear 1-sinc 2 masks patterned with controlled optical density profiles have been written in highenergy electron beam sensitive (HEBS) glass. The HEBS glass darkens to greater opacity with increased electron beam exposure. Significant progress has been made both in the processes for fabrication of the glass and electron beam writing as well as in the characterization of the finished masks. Figure i-2 shows the linear mask and the corresponding image recorded in the HCIT. Measurement of phase retardation, optical density, optical constants, and polarization properties are underway or in work. An alternative binary mask design employs electron beam lithography of aluminum on glass. Development has produced test articles, shown in Figure i-3, which are currently under test in the HCIT for comparison with the gray scale mask performance. Figure i-2. Mask (left) and image (right). The mask is included in the optical train of the HCIT where the corresponding image is recorded. Figure i-3. Binary 1-sinc 2 mask (left) produced by electron-beam lithography of aluminium on glass for f/28.55 and wavelength 785 nm, binary continuous sin 2 mask pattern (middle), and binary discontinuous sin 2 mask pattern (right). In 2003 Xinetics produced 32 × 32 mm, 1024-actuator DM modules that demonstrated 0.1-nm rms surface deformation control on the HCIT. Advances in the connector technology have made it possible to combine multiple modules behind a single facesheet. Currently, 4096-actuator DMs built up of four individual modules driving a single 64 × 64-mm facesheet have been delivered, and 96 × 96-mm DMs are in production. Examples are shown in Figure i-4. Thermal control, improved calibration, and electronics development have yielded command resolution of
Page 1 and 2: JPL Publication 05-8 Technology Pla
Page 3: TECHNOLOGY PLAN TERRESTRIAL PLANET
Page 8 and 9: Figure i-4. Deformable mirror deliv
Page 10 and 11: Table of Contents Approvals........
Page 12 and 13: 7.5.2 Precision Hexapod............
Page 14 and 15: Chapter 1 Figure 1-1. Artist's impr
Page 16 and 17: Chapter 1 interferometry, continues
Page 18 and 19: Chapter 1 Back end coronagraph opti
Page 20 and 21: Chapter 1 Surrounding the whole tel
Page 22 and 23: Chapter 1 Pol. BS fold/steering Mic
Page 24 and 25: Chapter 1 1.6.5 Sunshield The teles
Page 26 and 27: Chapter 1 expected architecture dow
Page 28 and 29: Chapter 1 Table 1-3. TPF-C Technolo
Page 30 and 31: Chapter 1 3B: Demonstrate, using th
Page 32 and 33: Chapter 2 2 Error Budgets 2.1 Contr
Page 34 and 35: Chapter 2 Error Budget Validation G
Page 36 and 37: Chapter 2 Further, it is shown that
Page 38 and 39: Chapter 2 Table 2-1. Requirement on
Page 40 and 41: Chapter 3 3 Optics and Starlight Su
Page 42 and 43: Chapter 3 are in progress with cont
Page 44 and 45: Chapter 3 Figure 3-5. Coronagraph s
Page 46 and 47: Chapter 3 (though not light-weight
Page 48 and 49: Chapter 3 Table 3-3. ITT Metrology
Page 50 and 51: Chapter 3 observations. The time it
Page 52 and 53: Chapter 3 vacuum-compatible, low-po
Page 54 and 55: Chapter 3 blank size. Westerhoff et
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Chapter 3 configurations, performan
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Chapter 3 Figure 3-10: Plots showin
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Chapter 3 The wavefront quality of
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Chapter 3 Figure 3-13. Optical layo
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Chapter 3 algorithms have limitatio
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Chapter 3 simulated star source is
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Chapter 4 Figure 4-1. Overview of t
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Chapter 4 enclosures, and stable la
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Chapter 4 facilities from which dat
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Chapter 4 Figure 4-5. Microslip Tri
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Chapter 4 Figure 4-7. Calibration o
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Chapter 4 Figure 4-8. Comparison of
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Chapter 4 4.2 Subsystem and System
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Chapter 4 Figure 4-11. Schematic of
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Chapter 4 Figure 4-12. Fine guiding
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Chapter 4 (5) The Fine Steering Mir
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Chapter 4 Third, precise thermal co
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Chapter 4 giving confidence that fl
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Chapter 4 surface polish is nonethe
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Chapter 5 TPF-C is planning a suite
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Chapter 5 engineering judgment (i.e
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Chapter 5 categories, in reality ea
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Chapter 5 Table 5-3. Validation of
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Chapter 5 5.6.1 Modeling Methodolog
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Chapter 5 strength of computer simu
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Chapter 6 6 Instrument Technology a
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Chapter 6 Figure 6-1. Detailed conc
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Chapter 6 The first method is self-
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Chapter 6 super computers and is us
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Chapter 7 7 Plan for Technology Dev
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Chapter 7 Figure 7-1. TPF-C Technol
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Chapter 7 Improvements to the DM ov
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Chapter 7 7.3 Error Budgets 7.3.1 D
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Chapter 7 7.4 Optics and Starlight
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Chapter 7 7.4.2 Apodizing Masks and
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Chapter 7 7.4.4 Wavefront Sensing a
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Chapter 7 7.4.6 Transmissive Optics
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Chapter 7 7.4.8 Scatterometer Scope
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Chapter 7 7.5 Structural, Thermal,
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Chapter 7 7.5.3 Precision Structura
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Chapter 7 model of TPF-C and should
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Chapter 7 7.5.6 Secondary Mirror To
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Chapter 7 7.5.8 Sub-scale EM Sunshi
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Chapter 7 7.6 Integrated Modeling a
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Chapter 7 7.7.3 Advanced Concepts:
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Chapter 8 134
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Appendices Appendix B: TPF-C Detail
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Appendices Appendix D: TPF-C Techno
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Appendices Appendix F: Acronym List
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Appendices RWA SAO SBIR SIM SM SMFA
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TPF-C Technology Plan - Exoplanet Exploration Program - NASA

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