TPF-C Technology Plan - Exoplanet Exploration Program - NASA
TPF-C Technology Plan - Exoplanet Exploration Program - NASA
TPF-C Technology Plan - Exoplanet Exploration Program - NASA
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Structural, Thermal, and Spacecraft <strong>Technology</strong><br />
Material property measurements will not be limited to CTE alone. The Project will establish a<br />
list of all material properties required for assessing performance stability using the integrated<br />
thermal, structural and optical models. Included in this material property list are all elements in<br />
the dynamic and thermal load paths, including joints, cables, etc. Data will be needed for these<br />
properties as a function of temperature, wavelength, frequency, and load cycle as appropriate.<br />
Published literature data will be reviewed, and if it is established that the quality of the published<br />
data does not meet <strong>TPF</strong>-C accuracy requirements, then additional materials testing will be<br />
performed. Accuracy requirements on material property data will be defined later as more<br />
analysis is performed to understand the sensitivity of material data error on predicted<br />
performance. Allocations for material data error will eventually be folded into the Modeling<br />
Uncertainty Factor allocation. Ultimately, all material property data assembled under this<br />
endeavor will be gathered within a Project-controlled database for use on all <strong>TPF</strong>-C modeling<br />
activities.<br />
Microslip Tribometer Characterization Facility<br />
The (Cryogenic) Microslip Tribometer Characterization (MTC) facility will measure the<br />
coefficient of friction in the microslip regime well below the onset of gross Coulombic slip. This<br />
information is required as a physical parameter within established microslip hysteresis model<br />
forms which combine both stress-induced and roughness-induced microslip. Data will be<br />
collected for representative materials of frictional interfaces, such as hinges and latches, with<br />
varying surface roughness specifications and over the temperature range of 305 K and 20 K to<br />
investigate thermal sensitivities. The MTC, shown in Figure 4-5, is designed, built, and<br />
calibrated in air by Dr. Jason Hinkle at the University of Colorado. The apparatus will be<br />
delivered to JPL to be placed within a thermally controlled cryogenic vacuum chamber.<br />
Representative data sets are shown in Figure 4-6. Data collected on this facility will be enclosed<br />
in the <strong>TPF</strong>-C Project Material Database.<br />
Precision Sub-Structure Test Facility<br />
The Precision Sub-Structure (PSS) test facility will be developed at JPL to characterize the<br />
thermo-mechanical stability of composite materials, composite structure sub-assemblies, and<br />
eventually actual flight hardware including hinges and latches. The facility will derive<br />
experience gained on the Precision Dilatometer test facility to incorporate a sub-nm<br />
interferometric metrology system within a thermally controlled vacuum chamber to enable<br />
distortion and strain measurements for these mechanical sub-assemblies. The current testbed goal<br />
is to achieve better than 1-nm measurement accuracy over a 1 minute time interval, which is<br />
consistent with current requirements on the SM tower stability. Better measurement<br />
performances have already been achieved on the Precision Dilatometer test facility and the SIM<br />
Thermo-Optical Mechanical testbeds, so the measurement capability itself is not seen as a risk.<br />
The immediate goal will be to collect property data for non-optical materials. The focus will be<br />
on measuring and understanding the thermal strain, CTE, material variability, microdynamics,<br />
and dimensional stability of proposed composite materials on <strong>TPF</strong>-C. Of special interest are the<br />
materials forming the PM support structure, the SM tower, and the coronagraph optical bench.<br />
Over time the facility will be used to investigate the dimensional stability and thermal sensitivity<br />
of critical sub-assemblies such as bonded composite parts, bearings, hinges and latches, and<br />
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