TPF-C Technology Plan - Exoplanet Exploration Program - NASA

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Chapter 3 simulated star source is suppressed to the appropriate contrast level. The requirements for the PDS have yet to be developed regarding spectral and polarization properties. Similarly, the need for the PDS mirror to duplicate aspects of the planned TPF-C primary mirror fabrication approach have yet to be considered. 54
Structural, Thermal, and Spacecraft Technology 4 Structural, Thermal, and Spacecraft Technology 4.1 Components Technology 4.1.1 Metrology Components Objective The extremely high contrast ratio requirement of the TPF coronagraph requires in turn that the telescope secondary mirror be positioned with respect to the primary with a precision of 50 nm over time scales of up to 24 hours. This level of position control demands precision metrology to measure the variation in position of the secondary. The adoption of the 8 th order mask design has significantly relaxed this requirement from the previous requirement of 300 pm with the 4 th - order design. This activity is aimed at providing the technology necessary to measure the relative SM-PM position. Approach The baseline approach is to adapt the SIM external metrology truss, based on common path heterodyne interferometers (COPHIs), to TPF-C. The sensing scheme provides the secondary mirror position in all 6 DOFs as shown in Figure 4-1. This involves splitting the beam into a number of components, directing it along paths between the primary and secondary, and interfering the outgoing and returning beams to extract the variations in distance between the two mirrors. Key components are beam launchers, fiducials, and sources. A beam launcher is a compact interferometer that sends a laser beam on a path whose length is being monitored. Metrology fiducials are retro-reflectors which don’t change the path length of the beam being reflected and must be mounted to give a stable reference for the measured path. Metrology sources consist of two lasers, acousto-optic modulators (AOM) for frequency shifting and power switching systems. Various associated optical components may be employed, including fiber beam positioners, corner cube reflectors, and low loss optical cavities. SIM metrology requirements exceed those of TPF-C in all areas with the single exception of the frequency stability of the laser, which is required to be ~10 -9 over a 24-hour timescale. Components SIM will develop and flight qualify include beam launchers, metrology fiducials 55
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JPL Publication 05-8 Technology Pla
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TECHNOLOGY PLAN TERRESTRIAL PLANET
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Recent Highlights Technical progres
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Figure i-4. Deformable mirror deliv
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Table of Contents Approvals........
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7.5.2 Precision Hexapod............
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Chapter 1 Figure 1-1. Artist's impr
Page 16 and 17: Chapter 1 interferometry, continues
Page 18 and 19: Chapter 1 Back end coronagraph opti
Page 20 and 21: Chapter 1 Surrounding the whole tel
Page 22 and 23: Chapter 1 Pol. BS fold/steering Mic
Page 24 and 25: Chapter 1 1.6.5 Sunshield The teles
Page 26 and 27: Chapter 1 expected architecture dow
Page 28 and 29: Chapter 1 Table 1-3. TPF-C Technolo
Page 30 and 31: Chapter 1 3B: Demonstrate, using th
Page 32 and 33: Chapter 2 2 Error Budgets 2.1 Contr
Page 34 and 35: Chapter 2 Error Budget Validation G
Page 36 and 37: Chapter 2 Further, it is shown that
Page 38 and 39: Chapter 2 Table 2-1. Requirement on
Page 40 and 41: Chapter 3 3 Optics and Starlight Su
Page 42 and 43: Chapter 3 are in progress with cont
Page 44 and 45: Chapter 3 Figure 3-5. Coronagraph s
Page 46 and 47: Chapter 3 (though not light-weight
Page 48 and 49: Chapter 3 Table 3-3. ITT Metrology
Page 50 and 51: Chapter 3 observations. The time it
Page 52 and 53: Chapter 3 vacuum-compatible, low-po
Page 54 and 55: Chapter 3 blank size. Westerhoff et
Page 56 and 57: Chapter 3 configurations, performan
Page 58 and 59: Chapter 3 Figure 3-10: Plots showin
Page 60 and 61: Chapter 3 The wavefront quality of
Page 62 and 63: Chapter 3 Figure 3-13. Optical layo
Page 64 and 65: Chapter 3 algorithms have limitatio
Page 68 and 69: Chapter 4 Figure 4-1. Overview of t
Page 70 and 71: Chapter 4 enclosures, and stable la
Page 72 and 73: Chapter 4 facilities from which dat
Page 74 and 75: Chapter 4 Figure 4-5. Microslip Tri
Page 76 and 77: Chapter 4 Figure 4-7. Calibration o
Page 78 and 79: Chapter 4 Figure 4-8. Comparison of
Page 80 and 81: Chapter 4 4.2 Subsystem and System
Page 82 and 83: Chapter 4 Figure 4-11. Schematic of
Page 84 and 85: Chapter 4 Figure 4-12. Fine guiding
Page 86 and 87: Chapter 4 (5) The Fine Steering Mir
Page 88 and 89: Chapter 4 Third, precise thermal co
Page 90 and 91: Chapter 4 giving confidence that fl
Page 92 and 93: Chapter 4 surface polish is nonethe
Page 94 and 95: Chapter 5 TPF-C is planning a suite
Page 96 and 97: Chapter 5 engineering judgment (i.e
Page 98 and 99: Chapter 5 categories, in reality ea
Page 100 and 101: Chapter 5 Table 5-3. Validation of
Page 102 and 103: Chapter 5 5.6.1 Modeling Methodolog
Page 104 and 105: Chapter 5 strength of computer simu
Page 106 and 107: Chapter 6 6 Instrument Technology a
Page 108 and 109: Chapter 6 Figure 6-1. Detailed conc
Page 110 and 111: Chapter 6 The first method is self-
Page 112 and 113: Chapter 6 super computers and is us
Page 114 and 115: Chapter 7 7 Plan for Technology Dev
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Chapter 7 Figure 7-1. TPF-C Technol
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Chapter 7 Improvements to the DM ov
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Chapter 7 7.3 Error Budgets 7.3.1 D
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Chapter 7 7.4 Optics and Starlight
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Chapter 7 7.4.2 Apodizing Masks and
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Chapter 7 7.4.4 Wavefront Sensing a
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Chapter 7 7.4.6 Transmissive Optics
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Chapter 7 7.4.8 Scatterometer Scope
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Chapter 7 7.5 Structural, Thermal,
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Chapter 7 7.5.3 Precision Structura
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Chapter 7 model of TPF-C and should
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Chapter 7 7.5.6 Secondary Mirror To
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Chapter 7 7.5.8 Sub-scale EM Sunshi
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Chapter 7 7.6 Integrated Modeling a
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Chapter 7 7.7.3 Advanced Concepts:
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Chapter 8 134
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Appendices Appendix B: TPF-C Detail
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Appendices Appendix D: TPF-C Techno
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Appendices Appendix F: Acronym List
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Appendices RWA SAO SBIR SIM SM SMFA
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TPF-C Technology Plan - Exoplanet Exploration Program - NASA

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