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216 Understanding Smart SensorsOxide Si wafer (p-type)n-typeSiMetalThin oxideOxideResistor Si planesL1L2bwSubstrate(a)(b)Figure 9.12 (a) AFM (after: [21]), and (b) SEM of actual unit (courtesy of Park ScientificInstruments).
MEMS Beyond Sensors 217+ 10°− 10°Support postMirror elementTorsion hingeSilicon substrateOffset addresselectrodesMirror landingelectrodeFigure 9.13 Digital micromirror with torsion hinge suspension.deflect the mirror without aid of external probes. Figure 9.14 shows the mirrorin the upright position.9.3.6 Heating ElementsMultijunction thermal converters (MJTC) have been fabricated using a standardCMOS process and bulk micromachining [23]. After CMOS processing,a cavity is etched by bulk micromachining that produces a suspended MJTCcantilever structure, as shown in Figure 9.15. Polysilicon resistive heating elementsand aluminum-polysilicon thermocouple junctions are encapsulated inglass. The glass protects those elements from the etchant and provides amechanical support. MJTCs have potential applications in low-cost, highprecisionRF and microwave power circuits.9.3.7 Thermionic EmittersArrays of sputtered tungsten thermionic emitters have been fabricated by surfacemicromachining [24]. An SiO 2 layer isolates sputtered tungsten from thesilicon substrate. The tungsten is patterned by wet etching, and the silicon isalso wet-etched under the filament to avoid contact. The filaments were testedin a vacuum of 5 ⋅ 10 −7 torr. The filaments changed from barely visible red towhite light once they start to emit. Operating life approaching 1 hr has been
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Understanding Smart SensorsSecond E
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Library of Congress Cataloging-in-P
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ContentsPrefacexix1 Smart Sensor Ba
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Contentsix3.3.3 Hall Effect 603.3.4
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Contentsxi5.8 Summary 116References
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Contentsxiii8.3.1 Surface Acoustica
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Contentsxv11.1.1 Integration and Me
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Contentsxvii14.4.4 Electrostatic Me
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PrefaceThe number one challenge fac
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Prefacexxifor well over 6 years. A
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2 Understanding Smart Sensorsobserv
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4 Understanding Smart Sensorssmart
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6 Understanding Smart Sensorsto pro
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8 Understanding Smart Sensorsinclud
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10 Understanding Smart SensorsLevel
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12 Understanding Smart Sensorsuser
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14 Understanding Smart Sensorstechn
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16 Understanding Smart Sensorschang
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18 Understanding Smart Sensorstechn
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20 Understanding Smart Sensors Surf
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22 Understanding Smart Sensorssecon
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24 Understanding Smart SensorsSilic
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26 Understanding Smart SensorsSilic
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28 Understanding Smart SensorsSacri
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30 Understanding Smart Sensors2.4.3
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32 Understanding Smart Sensorsmeasu
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34 Understanding Smart SensorsIon+S
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36 Understanding Smart Sensorssidew
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38 Understanding Smart SensorsTable
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40 Understanding Smart Sensorsoptim
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42 Understanding Smart SensorsAlumi
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44 Understanding Smart SensorsThe f
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46 Understanding Smart Sensors[21]
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The Nature of Semiconductor Sensor
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4Getting Sensor Information Into th
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Getting Sensor Information Into the
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5Using MCUs/DSPs to Increase Sensor
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Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Page 193 and 194: Control Techniques 171[19] De Silva
Page 195 and 196: 8Transceivers, Transponders, andTel
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Page 227 and 228: MEMS Beyond Sensors 205PyrexSilicon
Page 229 and 230: MEMS Beyond Sensors 207(a)IFluxIIMa
Page 231 and 232: MEMS Beyond Sensors 209InletThermop
Page 233 and 234: MEMS Beyond Sensors 211Figure 9.8 A
Page 235 and 236: MEMS Beyond Sensors 2139.3.2 Microo
Page 237: MEMS Beyond Sensors 215Over-range p
Page 241 and 242: MEMS Beyond Sensors 219achieved wit
Page 243 and 244: MEMS Beyond Sensors 221Methods for
Page 245 and 246: MEMS Beyond Sensors 223Figure 9.19
Page 247 and 248: MEMS Beyond Sensors 225[21] Tortone
Page 249 and 250: 10Packaging, Testing, and Reliabili
Page 251 and 252: Packaging, Testing, and Reliability
Page 271 and 272: 11Mechatronics and Sensing SystemsP
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Mechatronics and Sensing Systems 26
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12Standards for Smart SensingThe la
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Standards for Smart Sensing 275Netw
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Standards for Smart Sensing 277NCAP
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Standards for Smart Sensing 279Proc
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Standards for Smart Sensing 281PID
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Standards for Smart Sensing 283•
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Standards for Smart Sensing 285•
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Standards for Smart Sensing 287Tabl
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Standards for Smart Sensing 289perf
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Standards for Smart Sensing 2911 0
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Standards for Smart Sensing 293obje
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Standards for Smart Sensing 295Mult
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13The Implications of Smart SensorS
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The Implications of Smart Sensor St
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14The Next Phase of Sensing Systems
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The Next Phase of Sensing Systems 3
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List of Acronyms and Abbreviations3
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List of Acronyms and Abbreviations
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Glossaryablationvaporization of mat
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Glossary 353buscalibrationconnectio
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Glossary 355end point straight line
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Glossary 357data transmission and p
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Glossary 359multiplexer device that
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Glossary 361repeatability the maxim
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Glossary 363spread spectrum techniq
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Glossary 365transducer a device con
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Selected BibliographyBooks and Jour
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Selected Bibliography 369Northeaste
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Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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