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Understanding Smart Sensors - Nomads.usp

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376 <strong>Understanding</strong> <strong>Smart</strong> <strong>Sensors</strong>Automated/remote sensing (continued)remote diagnosis, 302–3wireless protocol, 302Automatic driver sensor (ADS), 187Automotive Bit-Serial Universal InterfaceSystem (A-bus), 129Automotive protocols, 123–30A-bus, 129CAN, 126–29list of, 124OSEK, 129–30SAE J1850, 125–26TTP, 129VAN, 129See also ProtocolsAutomotive safety network, 306–8Autoreferencing, 110BACnet protocol, 133Ball grid array (BGA) package, 228defined, 234illustrated, 235OMPAC, 234See also PackagingBarometer application circuit, 79Batteries, 266BiCMOS, 72, 73, 176Bonding. See Wafer bondingBoro-phospho-silicate glass (BPSG), 34Building/office automationBACnet protocol, 133illustrated, 134protocol list, 124–25Bulk micromachining, 17, 19–21defined, 19etchant attributes, 21etch rates, 19, 20etch-stop techniques, 20, 21polymer films, 42structures, 20surface and LIGA comparison, 33surface micromachining combined with,30–31See also MicromachiningBusesdevice-level, 120sensor, 121–22topologies, 121CADcomposite, 326for MEMS, 325–26simulation capability and, 325Calibration-free pressure sensor system,111CAN protocol, 126–29CSMA/CR, 127data frame, 128defined, 126–27error frame, 128identifier field, 127industrial usage of, 130–31MCU with, 137–39message format, 127module, 137–38Motorola (MCAN), 137specification, 127, 129twisted-pair drivers, 129See also Automotive protocolsCapacitive sensing, 58–59Carrier sense, multiple access/collisionresolution (CSMA/CR), 127CEBus protocol, 135Cellular digital packet data (CDPD), 179Ceramic packaging, 232Chemical etching, 37–40IC technology and, 37–40processing temperatures, 40See also EtchingChemically assisted ion beam etching(CAIBE), 213Chemical sensors, 60–61conductance change, 60–61hydrocarbon, 61Closed-loop system, 150accelerometer circuit, 152comparison, 151observer for, 163See also ControlCode-division multiple access (CDMA), 179Collision detection, 120Common-mode rejection ratio(CMRR), 73, 74defined, 73power-supply, 90Communications, 119–46background, 120–22

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