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246 Understanding Smart Sensorstechniques that are unique to smart sensors most likely will be developed tomeet future requirements.References[1] Vaganov, V., H. Joseph, and S. Terry, “Matching Customer Application RequirementsWith Cost Effective Sensor Packaging and Testing,” Proc. Sensors Expo, Boston, May13–15, 1997, pp. 181–189.[2] Van Zant, P. Microchip Fabrication, New York: McGraw-Hill, 1990.[3] Benson, A. F., “Count on Conformal Coatings,” Assembly Engineering, June 1990, pp.20–23.[4] Frank, R., and J. Staller, “The Merging of Micromachining and Microelectronics,” Proc.Third Internat’l Forum on ASIC and Transducer Technology, Banff, Alberta, Canada, May20–23, 1990, pp. 53–60.[5] Ristic, L. J., Sensor Technology and Devices, Norwood, MA: Artech House, 1994.[6] Blood, W. R., and J. S. Carey, “Practical Manufacturing of MCMs,” Surface Mount Technology,Nov. 1992, pp. 16–22.[7] Czarnocki, W. S., and J. P. Schuster, “Robust, Modular, Integrated Pressure Sensor,” Sensor95 Internat’l Conference on Sensors, Transducers, and Systems, Nuremburg, Germany,May 1995.[8] Chin, S., “Ball Grid Array Package Challenges Quad Flatpack,” Electronic Products, Apr.1993, pp. 19–20.[9] Oncore Ad, Automotive Industries, Oct. 1994, p. 71.[10] Babyak, R. J., “Electronics,” Appliance Manufacturer, May 1994, pp. 95–99.[11] Markus, K. W., V. Dhuler, and A. Cowen, “Smart MEMS: Flip Chip Integration ofMEMS and Electronics,” Proc. Sensors Expo, Cleveland, Sept. 20–22, 1994, pp. 559–564.[12] Linear/Interface ICs Device Data Book, Vol. II, DL128/D Rev. 4, Motorola SemiconductorProducts Sector, Phoenix, 1994.[13] Hill, G., J. Clementi, and J. Palomaki, “Epoxy Encapsulation Improves Flip Chip Bonding,”Electronic Packaging and Production, Aug. 1993, pp. 46–49.[14] Maudie, T., and B. Tucker, “Reliability Issues for Silicon Pressure Sensors,” Proc. SensorsExpo ’91, Chicago, Oct. 1–3, 1991, pp. 101-1 to 101-8.[15] Frank, R., and T. Maudie, “Surviving the Automotive Environment,” Electronic EngineeringTimes 1995 Systems Design Guide, Special Issue, 1995.[16] Maudie, T., D. J. Monk, and R. Frank, “Packaging Considerations for Predictable LifetimeSensors,” Proc. Sensors Expo, Boston, May 13–15, 1997, pp. 167–172.
Packaging, Testing, and Reliability Implications of Smarter Sensors 247[17] Reedholm, J., and T. Turner, “Wafer-Level Reliability,” Microelectronics ManufacturingTechnology, Apr. 1991, pp. 28–32.[18] Frank, R., and D. Zehrbach, “Testing the System on a Chip,” Proc. Sensors Expo, San Jose,CA, May 19–21, 1998, pp. 235–238.
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Understanding Smart SensorsSecond E
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Library of Congress Cataloging-in-P
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ContentsPrefacexix1 Smart Sensor Ba
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Contentsix3.3.3 Hall Effect 603.3.4
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Contentsxi5.8 Summary 116References
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Contentsxiii8.3.1 Surface Acoustica
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Contentsxv11.1.1 Integration and Me
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Contentsxvii14.4.4 Electrostatic Me
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PrefaceThe number one challenge fac
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Prefacexxifor well over 6 years. A
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2 Understanding Smart Sensorsobserv
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4 Understanding Smart Sensorssmart
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6 Understanding Smart Sensorsto pro
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8 Understanding Smart Sensorsinclud
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10 Understanding Smart SensorsLevel
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12 Understanding Smart Sensorsuser
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14 Understanding Smart Sensorstechn
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16 Understanding Smart Sensorschang
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18 Understanding Smart Sensorstechn
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20 Understanding Smart Sensors Surf
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22 Understanding Smart Sensorssecon
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24 Understanding Smart SensorsSilic
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26 Understanding Smart SensorsSilic
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28 Understanding Smart SensorsSacri
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30 Understanding Smart Sensors2.4.3
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32 Understanding Smart Sensorsmeasu
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34 Understanding Smart SensorsIon+S
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36 Understanding Smart Sensorssidew
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38 Understanding Smart SensorsTable
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40 Understanding Smart Sensorsoptim
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42 Understanding Smart SensorsAlumi
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44 Understanding Smart SensorsThe f
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46 Understanding Smart Sensors[21]
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The Nature of Semiconductor Sensor
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4Getting Sensor Information Into th
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Getting Sensor Information Into the
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5Using MCUs/DSPs to Increase Sensor
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Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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Communications for Smart Sensors 12
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Control Techniques 165linear-vector
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Control Techniques 1677.7.2 Combine
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Control Techniques 169Domain-type s
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Control Techniques 171[19] De Silva
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8Transceivers, Transponders, andTel
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Transceivers, Transponders, and Tel
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Page 217 and 218: Transceivers, Transponders, and Tel
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Page 231 and 232: MEMS Beyond Sensors 209InletThermop
Page 233 and 234: MEMS Beyond Sensors 211Figure 9.8 A
Page 235 and 236: MEMS Beyond Sensors 2139.3.2 Microo
Page 237 and 238: MEMS Beyond Sensors 215Over-range p
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Page 241 and 242: MEMS Beyond Sensors 219achieved wit
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Page 245 and 246: MEMS Beyond Sensors 223Figure 9.19
Page 247 and 248: MEMS Beyond Sensors 225[21] Tortone
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Page 251 and 252: Packaging, Testing, and Reliability
Page 267: Packaging, Testing, and Reliability
Page 271 and 272: 11Mechatronics and Sensing SystemsP
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Page 295 and 296: 12Standards for Smart SensingThe la
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Page 299 and 300: Standards for Smart Sensing 277NCAP
Page 301 and 302: Standards for Smart Sensing 279Proc
Page 303 and 304: Standards for Smart Sensing 281PID
Page 305 and 306: Standards for Smart Sensing 283•
Page 307 and 308: Standards for Smart Sensing 285•
Page 309 and 310: Standards for Smart Sensing 287Tabl
Page 311 and 312: Standards for Smart Sensing 289perf
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Page 315 and 316: Standards for Smart Sensing 293obje
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13The Implications of Smart SensorS
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The Implications of Smart Sensor St
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14The Next Phase of Sensing Systems
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The Next Phase of Sensing Systems 3
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List of Acronyms and Abbreviations3
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List of Acronyms and Abbreviations
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Glossaryablationvaporization of mat
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Glossary 353buscalibrationconnectio
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Glossary 355end point straight line
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Glossary 357data transmission and p
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Glossary 359multiplexer device that
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Glossary 361repeatability the maxim
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Glossary 363spread spectrum techniq
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Glossary 365transducer a device con
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Selected BibliographyBooks and Jour
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Selected Bibliography 369Northeaste
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Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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