Understanding Smart Sensors - Nomads.usp

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8 Understanding Smart Sensorsincluded in the smart sensor. Once the signal is in digital format, it can becommunicated by several communication protocols. The regulated powersupply also required for the system and its effect on system accuracy mustbe taken into account. That is becoming more of an issue as power managementissues are addressed in system design and different supply voltagesproliferate.Reducing the number of discrete elements in a smart sensor (or any system)is desirable to reduce the number of components, form factor, interconnections,assembly cost, and frequently component cost as well. The choices forhow that integration occurs are often a function of the original expertise of theintegrator. For example, as shown in Figure 1.6, a sensor manufacturer thatalready uses semiconductor, that is, bipolar or metal oxide semiconductor(MOS), technology for the sensing element may expand the capability andincrease the value (and intelligence) of the sensing unit it produces by combiningthe signal conditioning in the same package or in a sensor module.Through integration, the signal conditioning can also be combined at the sametime the sensor is fabricated or manufactured.While the process of integration is more complex, the integrated sensorcan be manufactured with the sensor and signal conditioning optimized for aparticular application. Conversely, an MCU manufacturer using a complementarymetal oxide semiconductor (CMOS) process typically integrates memory,A/D, and additional signal conditioning to reduce the number of componentsin the system. A variety of combinations are indicated in Figure 1.6. Processingtechnology is a key factor. However, manufacturers not only must be willing tointegrate additional system components, they also must achieve a cost-effectivesolution. Combinations of hybrid (package level) and monolithic integrationare discussed frequently in the remainder of this book. Different design philosophiesand the necessity to partition the sensor/system at different points candetermine whether a smart sensor is purchased or, alternatively, designed usinga sensor signal processor or other components necessary to meet the desiredperformance of the end product.The integration path can have a significant effect on the ultimate level ofcomponent reduction. As shown in Figure 1.7 [8], the input (demonstrated bya pressure sensor), computing (high-density CMOS [HCMOS] microcontroller),and output side (power MOS) are all increasing the level of monolithicintegration. The choice of sensor technology, such as bipolar, can have a limitingeffect on how far the integration can progress. For example, a bipolar sensorcan increase integration level by adding signal conditioning and progress to amonolithic level III sensor. Through package-level integration, a two-chip sensorcontroller can be achieved by combining the sensor with an HCMOS
Smart Sensor Basics 9AnalogoutputsensorSignalconditioningA/DMemoryMCU/DSPandmemoryAnalogoutputsensorSignalconditioningA/DMemoryMCU/DSPandmemoryAnalogoutputsensorSignalconditioningA/DMemoryMCU/DSPandmemoryAnalogoutputsensorSignalconditioningA/DMemoryMCU/DSPandmemoryFigure 1.6 Partitioning and integration possibilities.microcontroller. However, the highest level of monolithic integration, level V,will be realized only by pursuing MOS-compatible sensing and power-controltechnologies.Realizing the full potential of those new sensors will require a newapproach to identify sensor applications. The list of sensor terms in Table 1.3serves as a starting point for rethinking the possibilities for smart sensors. Manyof the terms are associated with a system and not the sensor portion of thesystem.
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The Nature of Semiconductor Sensor
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4Getting Sensor Information Into th
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5Using MCUs/DSPs to Increase Sensor
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Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Control Techniques 165linear-vector
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Control Techniques 1677.7.2 Combine
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Control Techniques 169Domain-type s
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Control Techniques 171[19] De Silva
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8Transceivers, Transponders, andTel
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Transceivers, Transponders, and Tel
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9MEMS Beyond Sensors“And these ot
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MEMS Beyond Sensors 203would not ex
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MEMS Beyond Sensors 205PyrexSilicon
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MEMS Beyond Sensors 207(a)IFluxIIMa
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MEMS Beyond Sensors 209InletThermop
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MEMS Beyond Sensors 211Figure 9.8 A
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MEMS Beyond Sensors 2139.3.2 Microo
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MEMS Beyond Sensors 215Over-range p
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MEMS Beyond Sensors 217+ 10°− 10
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MEMS Beyond Sensors 219achieved wit
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MEMS Beyond Sensors 221Methods for
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MEMS Beyond Sensors 223Figure 9.19
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MEMS Beyond Sensors 225[21] Tortone
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10Packaging, Testing, and Reliabili
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Packaging, Testing, and Reliability
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11Mechatronics and Sensing SystemsP
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12Standards for Smart SensingThe la
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Standards for Smart Sensing 275Netw
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Standards for Smart Sensing 277NCAP
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Standards for Smart Sensing 279Proc
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Standards for Smart Sensing 281PID
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Standards for Smart Sensing 283•
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Standards for Smart Sensing 285•
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Standards for Smart Sensing 287Tabl
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Standards for Smart Sensing 289perf
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Standards for Smart Sensing 2911 0
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Standards for Smart Sensing 293obje
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Standards for Smart Sensing 295Mult
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13The Implications of Smart SensorS
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The Implications of Smart Sensor St
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14The Next Phase of Sensing Systems
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The Next Phase of Sensing Systems 3
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List of Acronyms and Abbreviations3
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List of Acronyms and Abbreviations
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Glossaryablationvaporization of mat
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Glossary 353buscalibrationconnectio
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Glossary 355end point straight line
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Glossary 357data transmission and p
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Glossary 359multiplexer device that
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Glossary 361repeatability the maxim
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Glossary 363spread spectrum techniq
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Glossary 365transducer a device con
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Selected BibliographyBooks and Jour
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Selected Bibliography 369Northeaste
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Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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