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256 Understanding Smart Sensorsautomobile battery. The sensor’s output was applied to external circuitry thatprovided shutdown prior to device failure. The sensing capability also allowsthe output device to provide an indication (with additional external circuitry) ifthe heatsinking is not proper when the unit is installed in a module, or if achange occurs in the application that would ultimately cause a failure.11.3.2 Current Sensing in Power ICsCurrent sensing provides protection and control in power ICs. A device thatdemonstrates that approach is shown in Figure 11.4 [4]. The circuit, shown inFigure 11.4(a), includes a voltage regulator, an oscillator, and a charge pump toprovide a high-side switch with an N-channel power MOSFET. This customdevice has multiple current sensing levels for control and fault detection, asshown in Figure 11.4(b). The current-sensing technique uses a sample of thecurrent flowing through the total power MOSFET cells, the ratio of thenumber of sample cells to control cells, as an indication of the total current. Aresistor in series with the sense cells, which handles considerably lower current,provides a voltage proportional to the current in the power device. ThisSENSEFET technique avoids adding a series resistance to the total onresistanceand the subsequent power consumption, which could be excessive foran integrated circuit. 1 The isolated sensing cells for four different currentsensinglevels are inside the four “lassoed” areas (left side, lower section in thecell area) in Figure 11.4(b). The highest current level could trigger an overcurrentfault, and the lower levels can be used for system-specific control points.11.3.3 DiagnosticsThe eight-output driver with serial communications shown in Figure 11.2 representsa high level of complexity for diagnostics. Control and sensing of thefaults of individual output drivers could require over 24 connections for eightoutput drivers. By using the SPI protocol described in Chapter 6, 8-bit serialcontrol of the output and independent diagnostics are possible with only threeconnections. The SPI operates at a frequency of up to 2 MHz and utilizes thelow-voltage, high-speed CMOS capability in the SMARTMOS (Motorola’spower IC) process. 2 With both the input and the output tied directly to theMCU, the unit acts as a closed-loop subsystem between the load and the MCUfor each load. By using a daisy chain technique, several additional devices can1. SENSEFET is a trademark of Semiconductor Components Industries (d.b.a. ON Semiconductor).2. SMARTMOS is a trademark of Motorola, Inc.
Mechatronics and Sensing Systems 257Supply voltageEnableInputModeFault/feedbackV regulatoroscillatorcharge pumpGatecontrolThermalshutdownOutputFaultlogicGroundCurrent limitload senseOpenvbatdetect(a)(b)Figure 11.4 Current sensing integrated in smart-power IC: (a) block diagram, and (b) diephotomicrograph. (Courtesy of Motorola, Inc.)
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Understanding Smart SensorsSecond E
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Library of Congress Cataloging-in-P
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ContentsPrefacexix1 Smart Sensor Ba
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Contentsix3.3.3 Hall Effect 603.3.4
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Contentsxi5.8 Summary 116References
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Contentsxiii8.3.1 Surface Acoustica
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Contentsxv11.1.1 Integration and Me
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Contentsxvii14.4.4 Electrostatic Me
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PrefaceThe number one challenge fac
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Prefacexxifor well over 6 years. A
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2 Understanding Smart Sensorsobserv
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4 Understanding Smart Sensorssmart
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6 Understanding Smart Sensorsto pro
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8 Understanding Smart Sensorsinclud
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10 Understanding Smart SensorsLevel
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12 Understanding Smart Sensorsuser
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14 Understanding Smart Sensorstechn
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16 Understanding Smart Sensorschang
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18 Understanding Smart Sensorstechn
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20 Understanding Smart Sensors Surf
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22 Understanding Smart Sensorssecon
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24 Understanding Smart SensorsSilic
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26 Understanding Smart SensorsSilic
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28 Understanding Smart SensorsSacri
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30 Understanding Smart Sensors2.4.3
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32 Understanding Smart Sensorsmeasu
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34 Understanding Smart SensorsIon+S
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36 Understanding Smart Sensorssidew
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38 Understanding Smart SensorsTable
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40 Understanding Smart Sensorsoptim
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42 Understanding Smart SensorsAlumi
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44 Understanding Smart SensorsThe f
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46 Understanding Smart Sensors[21]
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The Nature of Semiconductor Sensor
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4Getting Sensor Information Into th
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5Using MCUs/DSPs to Increase Sensor
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Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Control Techniques 165linear-vector
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Control Techniques 1677.7.2 Combine
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Control Techniques 169Domain-type s
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Control Techniques 171[19] De Silva
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8Transceivers, Transponders, andTel
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Transceivers, Transponders, and Tel
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9MEMS Beyond Sensors“And these ot
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MEMS Beyond Sensors 203would not ex
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Page 231 and 232: MEMS Beyond Sensors 209InletThermop
Page 233 and 234: MEMS Beyond Sensors 211Figure 9.8 A
Page 235 and 236: MEMS Beyond Sensors 2139.3.2 Microo
Page 237 and 238: MEMS Beyond Sensors 215Over-range p
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Page 241 and 242: MEMS Beyond Sensors 219achieved wit
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Page 245 and 246: MEMS Beyond Sensors 223Figure 9.19
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Page 251 and 252: Packaging, Testing, and Reliability
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Page 295 and 296: 12Standards for Smart SensingThe la
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Page 299 and 300: Standards for Smart Sensing 277NCAP
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Page 305 and 306: Standards for Smart Sensing 283•
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Page 309 and 310: Standards for Smart Sensing 287Tabl
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Page 315 and 316: Standards for Smart Sensing 293obje
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Page 319 and 320: 13The Implications of Smart SensorS
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The Implications of Smart Sensor St
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The Implications of Smart Sensor St
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14The Next Phase of Sensing Systems
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The Next Phase of Sensing Systems 3
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List of Acronyms and Abbreviations3
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List of Acronyms and Abbreviations
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Glossaryablationvaporization of mat
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Glossary 353buscalibrationconnectio
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Glossary 355end point straight line
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Glossary 357data transmission and p
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Glossary 359multiplexer device that
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Glossary 361repeatability the maxim
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Glossary 363spread spectrum techniq
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Glossary 365transducer a device con
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Selected BibliographyBooks and Jour
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Selected Bibliography 369Northeaste
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Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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