Understanding Smart Sensors - Nomads.usp

Index 383in chemical measurements, 262gas sensors, 263infrared focal plane array, 263–64multichannel probe, 262photodiode arrays, 263Multiple-type sensors, 264–65Multiplexing (MUX), 120Multiprocessor computing, 164Multiuser MEMS process (MUMPS), 219Nanoguitar, 222–23N-channel metal oxide semiconductor(NMOS), 30Near-obstacle detection systems(NODSs), 189–90Network-capable application processor(NCAP), 274IEEE 1451.1, 276–78IEEE P1451.4, 293, 294PC, 281triggers, 284Networked vehicle, wireless sensing, 323–24Networksairplane, 306automotive safety, 306–8extending sensing systems to, 293–95industrial, 133neural, 157–60Neural networks, 157–60application example, 160defined, 157–58fuzzy logic combined with, 160illustrated, 159neurons, 158uses, 158See also ControlNeuron IC, 139–41block diagram, 141defined, 139direct-mode transceiver, 140Niche area network (NAN), 307Noise, 65–66flicker, 66shot, 65–66types of, 65–66Nyquist rate, converters, 87Object linking and embedding (OLE), 298One-time programmable (OTP) ROM, 98On-off keying (OOK), 179Open-loop system, 150accelerometer circuit, 152comparison, 151See also ControlOpen Systems Interconnection(OSI), 120, 123Operationrail-to-rail, 76–77static vs. dynamic, 57Optical signal transmission, 182OSEK protocol, 129–30Overmolded pad array carrier(OMPAC), 234Overpressure, 56Oversampling, converters, 87Packagingball grid array (BGA), 228, 234–35ceramic, 232design, 229DIP, 228dual-chip, 233–34flip-chip, 237–38glob top, 239, 240hybrid, 231–35microBGA, 228for monolithic sensors, 235–39PGA, 228pinouts, increased, 231plastic, 236reliability and, 227requirements, 228semiconductor, 228–31SIP, 228standards, 245surface-mounted, 236–37through-hole, 228wafer-level, 238–39Particulate control, surface micromachining,30Partitioningpossibilities, 9system, 250Parylene deposition, 231Passivation layer, 230Performance ADC, 89–90Peripherals, MCU, 96–97