Understanding Smart Sensors - Nomads.usp

The Next Phase of Sensing Systems 313Materials International (SEMI). Based on the disruptive implications ofMEMS, established companies may not be the ones finding successful smartsensor applications.14.2 Future Semiconductor CapabilitiesBecause micromachined sensors are based on semiconductor technology, asemiconductor industry roadmap could provide insight into future sensingtechnology. The Semiconductor Industry Association (SIA) periodically publishestechnology predictions for future capabilities of leading-edge semiconductors.As shown in Table 14.2 [3], by 2012 the minimum feature size for thehighest performance microprocessor circuits will be only 35 nm, only aboutone-sixth the size of a 1997 feature. The packaged cost will be reduced by moreTable 14.2Projected Semiconductor Technology CapabilityCharacteristicYear1997 1999 2001 2003 2006 2009 2012Minimum feature 200 140 120 100 70 50 35size (nm)Logic transistors/cm 2 3.7M 6.2M 10M 18M 39M 84M 180M(packed)Cost/transistor @ 910 525 305 175 75 34 15volume (microcents)Maximum number 6 6–7 7 7 7–8 8–9 9of wiring levels (logic)Electrical defect density 1,940 1,710 1,510 1,355 1,120 940 775(d/m 2 ) 60%Minimum mask count 22 22/24 23 24 24/26 26/28 28Chip size (mm 2 ) ASIC 480 800 850 900 1,000 1,100 1,300Power supply voltage 1.8–2.5 1.5–1.8 1.2–1.5 1.2–1.5 0.9–1.2 0.6–0.9 0.5–0.6(logic)Number of chips I/OS 800 975 1,195 1,460 1,970 2,655 3,585(cost-performance)Performance (MHz)(chip-board)250 480 785 885 1,035 1,285 1,540