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322 Understanding Smart Sensors(a)(b)Figure 14.4 Micromachined (a) ring and (b) angular rate sensor. (Courtesy of Delphi DelcoElectronic Systems.)
The Next Phase of Sensing Systems 323BulkmicromachineddiaphragmFigure 14.5 Photomicrograph of microcontroller with an integrated pressure sensor. (Courtesyof Motorola, Inc.)capability could be another step in the continuous integration of silicon andelectronic/electromechanical systems.The proof of concept vehicle was built using a 100-kPa pressure sensorintegrated onto a standard 8-bit 68HC05 MCU core along with the associatedanalog circuitry [18]. Figure 14.6 illustrates the block diagram, including an8-bit MCU core (68HC05) with 2K bytes EPROM, 128 bytes RAM, bootROM, and an SPI. Analog circuitry for signal conditioning, a voltage and currentregulator, and a 10-bit ADC and 8-bit DAC were added to the basic core.A temperature sensor was also incorporated into the design for compensationpurposes.14.4.7 Wireless Sensing in the Networked VehicleRF technology can add another dimension to smart sensors. A vehicle providessome interesting possibilities. It is possible to envision small micromachinedstructures with an integrated RF output or input interfaced through an RF busto a remote control unit performing their function without any visible means toverify their presence except the added functionality that they provide to thehost vehicle. That technique is already used in electronic identification in theRFID tag (see Chapter 8). One possible vehicle application is a wireless versionof an electronic “nose” [18]. The device could be mounted in an existing automotivecomponent such as the dome light housing. The dome light housingprovides a central position in the car for the nose to function, similar to a home
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Understanding Smart SensorsSecond E
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Library of Congress Cataloging-in-P
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ContentsPrefacexix1 Smart Sensor Ba
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Contentsix3.3.3 Hall Effect 603.3.4
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Contentsxi5.8 Summary 116References
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Contentsxiii8.3.1 Surface Acoustica
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Contentsxv11.1.1 Integration and Me
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Contentsxvii14.4.4 Electrostatic Me
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PrefaceThe number one challenge fac
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Prefacexxifor well over 6 years. A
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2 Understanding Smart Sensorsobserv
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4 Understanding Smart Sensorssmart
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6 Understanding Smart Sensorsto pro
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8 Understanding Smart Sensorsinclud
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10 Understanding Smart SensorsLevel
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12 Understanding Smart Sensorsuser
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14 Understanding Smart Sensorstechn
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16 Understanding Smart Sensorschang
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20 Understanding Smart Sensors Surf
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22 Understanding Smart Sensorssecon
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24 Understanding Smart SensorsSilic
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26 Understanding Smart SensorsSilic
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28 Understanding Smart SensorsSacri
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30 Understanding Smart Sensors2.4.3
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32 Understanding Smart Sensorsmeasu
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34 Understanding Smart SensorsIon+S
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36 Understanding Smart Sensorssidew
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38 Understanding Smart SensorsTable
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40 Understanding Smart Sensorsoptim
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42 Understanding Smart SensorsAlumi
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44 Understanding Smart SensorsThe f
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46 Understanding Smart Sensors[21]
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The Nature of Semiconductor Sensor
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4Getting Sensor Information Into th
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Getting Sensor Information Into the
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5Using MCUs/DSPs to Increase Sensor
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Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Control Techniques 165linear-vector
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Control Techniques 1677.7.2 Combine
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Control Techniques 169Domain-type s
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Control Techniques 171[19] De Silva
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8Transceivers, Transponders, andTel
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Transceivers, Transponders, and Tel
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9MEMS Beyond Sensors“And these ot
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MEMS Beyond Sensors 203would not ex
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MEMS Beyond Sensors 205PyrexSilicon
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MEMS Beyond Sensors 207(a)IFluxIIMa
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MEMS Beyond Sensors 209InletThermop
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MEMS Beyond Sensors 211Figure 9.8 A
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MEMS Beyond Sensors 2139.3.2 Microo
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MEMS Beyond Sensors 215Over-range p
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MEMS Beyond Sensors 217+ 10°− 10
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MEMS Beyond Sensors 219achieved wit
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MEMS Beyond Sensors 221Methods for
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MEMS Beyond Sensors 223Figure 9.19
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MEMS Beyond Sensors 225[21] Tortone
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10Packaging, Testing, and Reliabili
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Packaging, Testing, and Reliability
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11Mechatronics and Sensing SystemsP
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Page 293 and 294: Mechatronics and Sensing Systems 27
Page 295 and 296: 12Standards for Smart SensingThe la
Page 297 and 298: Standards for Smart Sensing 275Netw
Page 299 and 300: Standards for Smart Sensing 277NCAP
Page 301 and 302: Standards for Smart Sensing 279Proc
Page 303 and 304: Standards for Smart Sensing 281PID
Page 305 and 306: Standards for Smart Sensing 283•
Page 307 and 308: Standards for Smart Sensing 285•
Page 309 and 310: Standards for Smart Sensing 287Tabl
Page 311 and 312: Standards for Smart Sensing 289perf
Page 313 and 314: Standards for Smart Sensing 2911 0
Page 315 and 316: Standards for Smart Sensing 293obje
Page 317 and 318: Standards for Smart Sensing 295Mult
Page 319 and 320: 13The Implications of Smart SensorS
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Page 333 and 334: 14The Next Phase of Sensing Systems
Page 335 and 336: The Next Phase of Sensing Systems 3
Page 343: The Next Phase of Sensing Systems 3
Page 355 and 356: List of Acronyms and Abbreviations3
Page 357 and 358: List of Acronyms and Abbreviations
Page 373 and 374: Glossaryablationvaporization of mat
Page 375 and 376: Glossary 353buscalibrationconnectio
Page 377 and 378: Glossary 355end point straight line
Page 379 and 380: Glossary 357data transmission and p
Page 381 and 382: Glossary 359multiplexer device that
Page 383 and 384: Glossary 361repeatability the maxim
Page 385 and 386: Glossary 363spread spectrum techniq
Page 387 and 388: Glossary 365transducer a device con
Page 389 and 390: Selected BibliographyBooks and Jour
Page 391 and 392: Selected Bibliography 369Northeaste
Page 393 and 394: Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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