Understanding Smart Sensors - Nomads.usp

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218 Understanding Smart SensorsFigure 9.14 Hinged micromirror showing hinge and rail assemblies. (Courtesy of SandiaNational Laboratories.)Figure 9.15 An MJTC. (Courtesy of NIST and Ballantine Laboratories, Inc.)
MEMS Beyond Sensors 219achieved with emission currents of about 10 nA. The thermionic emitters areused as the first stage on a miniature SEM. The SEM is less than 2 cm 3 in volumeand is formed by stacking five silicon dice.Those recent developments in thermionics require examining terms thatare commonly used for semiconductors. The invention and volume productionof semiconductors or solid-state devices displaced vacuum tubes. However,thermionic devices made using semiconductor processes have now createdgaseous-state microdevices. Volume production of such devices is certain toraise comments if they are referred to as solid-state devices.9.3.8 Field Emission DisplaysA number of field emission displays (FEDs) are being developed usingmicromachining techniques [25]. An FED consists of an array of emittingmicrotips. In one approach, the microtips are formed by etching chambersinside a masked silicon wafer. Molybdenum tips are vacuum deposited in thechamber. Several hundred emitter tips are fabricated for each pixel, allowingdozens of tips to fail without discernible loss of brightness.Another technique to produce the microtips uses selective etching of apolycrystalline silicon substrate. This self-aligned process uses the crystal structureof silicon to produce atomically sharp silicon tips. It may be possible toeliminate lithography in this approach due to the self-aligning nature of theprocess. (The application of FEDs is discussed further in Chapter 11.)9.3.9 Unfoldable MicroelementsMicrostructures that have elastic joints have been used to make movable threedimensionalstructures from planar surface micromachined structures. Microrobotsare among the possibilities for such devices. The basis of the movablestructure is shown in Figure 9.16(a) [26]. Polyimide provides the flexible connectionto polysilicon plates or skeletonlike structures. The PSG is sacrificiallyetched to free the structure for the substrate. Released structures have actuallybeen folded at the hinges, like paper, creating microcubes and insectlike threedimensionalstructures.An SEM of a robotic bug example is shown in Figure 9.16(b) [27]. Thestructure was fabricated using MCNC’s multiuser MEMS process (MUMPS).The bug includes an actuator, electronics, sensors, an IR diode, and a solar cell.The microrobot is made from a silicon chip 1 cm by 0.5 cm by 0.5 mm.A surface-micromachined MEMS hinge designed for foldout structuresuses two structural layers of polysilicon to form both the hinge and the movableplate [28]. The most recent development is an improvement over an earlier
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Understanding Smart SensorsSecond E
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Library of Congress Cataloging-in-P
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ContentsPrefacexix1 Smart Sensor Ba
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Contentsix3.3.3 Hall Effect 603.3.4
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Contentsxi5.8 Summary 116References
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Contentsxiii8.3.1 Surface Acoustica
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Contentsxv11.1.1 Integration and Me
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Contentsxvii14.4.4 Electrostatic Me
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PrefaceThe number one challenge fac
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Prefacexxifor well over 6 years. A
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2 Understanding Smart Sensorsobserv
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4 Understanding Smart Sensorssmart
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6 Understanding Smart Sensorsto pro
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8 Understanding Smart Sensorsinclud
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10 Understanding Smart SensorsLevel
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12 Understanding Smart Sensorsuser
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14 Understanding Smart Sensorstechn
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16 Understanding Smart Sensorschang
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18 Understanding Smart Sensorstechn
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20 Understanding Smart Sensors Surf
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22 Understanding Smart Sensorssecon
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24 Understanding Smart SensorsSilic
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26 Understanding Smart SensorsSilic
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28 Understanding Smart SensorsSacri
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30 Understanding Smart Sensors2.4.3
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32 Understanding Smart Sensorsmeasu
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34 Understanding Smart SensorsIon+S
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36 Understanding Smart Sensorssidew
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38 Understanding Smart SensorsTable
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40 Understanding Smart Sensorsoptim
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42 Understanding Smart SensorsAlumi
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44 Understanding Smart SensorsThe f
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46 Understanding Smart Sensors[21]
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The Nature of Semiconductor Sensor
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4Getting Sensor Information Into th
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Getting Sensor Information Into the
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5Using MCUs/DSPs to Increase Sensor
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Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Control Techniques 165linear-vector
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Page 195 and 196: 8Transceivers, Transponders, andTel
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Page 227 and 228: MEMS Beyond Sensors 205PyrexSilicon
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Page 231 and 232: MEMS Beyond Sensors 209InletThermop
Page 233 and 234: MEMS Beyond Sensors 211Figure 9.8 A
Page 235 and 236: MEMS Beyond Sensors 2139.3.2 Microo
Page 237 and 238: MEMS Beyond Sensors 215Over-range p
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Page 243 and 244: MEMS Beyond Sensors 221Methods for
Page 245 and 246: MEMS Beyond Sensors 223Figure 9.19
Page 247 and 248: MEMS Beyond Sensors 225[21] Tortone
Page 249 and 250: 10Packaging, Testing, and Reliabili
Page 251 and 252: Packaging, Testing, and Reliability
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Mechatronics and Sensing Systems 26
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Mechatronics and Sensing Systems 27
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12Standards for Smart SensingThe la
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Standards for Smart Sensing 275Netw
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Standards for Smart Sensing 277NCAP
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Standards for Smart Sensing 279Proc
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Standards for Smart Sensing 281PID
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Standards for Smart Sensing 283•
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Standards for Smart Sensing 285•
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Standards for Smart Sensing 287Tabl
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Standards for Smart Sensing 289perf
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Standards for Smart Sensing 2911 0
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Standards for Smart Sensing 293obje
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Standards for Smart Sensing 295Mult
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13The Implications of Smart SensorS
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The Implications of Smart Sensor St
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14The Next Phase of Sensing Systems
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The Next Phase of Sensing Systems 3
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List of Acronyms and Abbreviations3
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List of Acronyms and Abbreviations
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Glossaryablationvaporization of mat
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Glossary 353buscalibrationconnectio
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Glossary 355end point straight line
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Glossary 357data transmission and p
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Glossary 359multiplexer device that
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Glossary 361repeatability the maxim
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Glossary 363spread spectrum techniq
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Glossary 365transducer a device con
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Selected BibliographyBooks and Jour
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Selected Bibliography 369Northeaste
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Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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