11.07.2015 Views

Understanding Smart Sensors - Nomads.usp

Understanding Smart Sensors - Nomads.usp

Understanding Smart Sensors - Nomads.usp

SHOW MORE
SHOW LESS

You also want an ePaper? Increase the reach of your titles

YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.

46 <strong>Understanding</strong> <strong>Smart</strong> <strong>Sensors</strong>[21] Choi, B., et al., “Development of Pressure Transducers Utilizing Deep X-Ray Lithography,”IEEE 91CH2817-5 From Transducers ’91, pp. 393–396.[22] Flamm, D. L., “Feed Gas Purity and Environmental Concerns in Plasma Etching,” SolidState Technology, Oct. 1993, pp. 49–54.[23] Zhang, Z. L., and N. C. McDonald, “A RIE Process for Submicron, Silicon ElectromechanicalStructures,” J. Micromechanics and Microengineering, Mar. 1992, pp. 31–38.[24] Friedrich, C. R., and M. J. Vasile, “Development of the Micromilling Process forHigh-Aspect-Ratio Microstructures,” J. Microelectromechanical Systems, Vol. 5, No. 1,Mar. 1996, pp. 33–38.[25] Swenson, E. J., “Laser Micromachining for Circuit Production,” Microelectronic Manufacturingand Testing, Mar. 1990, pp. 17–18.[26] Cumberledge, W., and J. M. Staller, “An Integrated On-Chip Pressure Sensor for AccurateControl Applications,” IEEE Solid-State <strong>Sensors</strong> and Actuators Workshop, Hilton Head,SC, 1986.[27] Alavi, M., et al., “Laser Machining for Fabrication of New Microstructures,” IEEE91CH2817-5 From Transducers ’91, pp. 512–515.[28] Romig, A. D., Jr., and J. H. Smith, “The Coming Revolution in ICs: Intelligent, IntegratedMicrosystems,” Micromachine Devices, Vol. 3, No. 2, Feb. 1998, pp. 4–6.[29] Baskett, I., R. Frank, and E. Ramsland, “The Design of a Monolithic Signal ConditionedPressure Sensor,” IEEE 91CH2994-2 Custom Integrated Circuits Conference ’91,pp. 273.1–273.4.[30] Marshall, J. C., et al., “High-Level CAD Melds Micromachined Devices With Foundries,”IEEE Circuits and Devices, Nov. 1992, pp. 10–17.[31] Riethmueller, W., et al., “Development of Commercial CMOS Process-Based Technologiesfor the Fabrication of <strong>Smart</strong> Accelerometers,” IEEE 91CH2817-5 From Transducers’91, pp. 416–419.[32] Yun, W., R. T. Howe, and P. R. Gray, “Surface Micromachined, Digitally Force-BalancedAccelerometer With Integrated CMOS Detection Circuitry,” IEEE <strong>Sensors</strong> and ActuatorsWorkshop, Hilton Head, SC, June 22–25, 1992, pp. 126–131.[33] Markus, K. W., V. Dhuler, and A. Cowen, “<strong>Smart</strong> MEMS: Flip Chip Integration ofMEMS and Electronics,” Proc. <strong>Sensors</strong> Expo, Cleveland, Sept. 20–22, 1994, pp. 559–564.[34] Ellis, C. D., et al., “Polycrystalline Diamond Film Flow Sensor,” IEEE Solid-State <strong>Sensors</strong>and Actuators Workshop, Hilton Head, SC, June 4–7, 1990, pp. 132–134.[35] Schiller, P., D. L. Polla, and M. Ghezzo, “Surface-Micromachined Piezoelectric Pressure<strong>Sensors</strong>,” IEEE 90CH2783-9 From <strong>Sensors</strong> and Actuators Workshop, Hilton Head, SC,June 4–7, 1990, pp. 188–190.[36] Choi, J. R., and P. Choi, “Micromachined ZnO Piezoelectric Pressure <strong>Sensors</strong> and PyroelectricInfrared Detector in GaAs,” J. Electrical Engineering and Information Science, Vol. 3,No. 2, Apr. 1998, pp. 239–244.

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!