Understanding Smart Sensors - Nomads.usp

Index 381Linearization, 108Linear prediction, 164Liquid crystal display (LCD), 15, 103LonTalk protocol, 131–32, 135defined, 131LonWorks system, 131–32Neuron chips and, 139–41Low-power wireless integrated microsensors(LWIMs), 196Low-pressure chemical vapor deposition(LPCVD), 34Low-pressure measurements, 67–68Low-pressure sensors, MCUs with, 68Magnetic pickups, 4Mechatronics, 249–70defined, 249embedded sensing, 252–61integration and, 250sensing arrays, 261–65smart-power ICs, 250–52use of, 249MemoryCAN MCU, 138MCU, 97–98Neuron chip, 141See also specific memory typesMetal oxide semiconductor (MOS), 8diffused (DMOS), 251fabrication processes, 114lateral diffused (LDMOS), 174Metal oxide semiconductor field effecttransistor (MOSFET)discrete power, 13fabrication, 42output devices, 13temperature sensing integration, 255Metal Oxide SemiconductorImplementation System(MOSIS), 38MI-Bus protocol, 141–42Michigan parallel standard (MPS), 122–23Microangular rate sensors, 321MicroBGA package, 228Microcontroller units (MCUs), 168HC05, 101–2, 113autoreferencing, 110block diagram, 96with CAN, 137–39CISC, 166control, 95–96cost, 109diagnostics, 111die size, 114DSP architecture vs., 106EMC/RFI reduction, 111–12for increasing sensor IQ, 93–116input manipulation, 112with integrated pressure sensor, 321–23I/O, 98–99LCDs driven from, 15lookup tables, 106–7low-pressure sensor with, 68MC68HC05EVM development tool for,113memory, 97–98modular design, 103–4MPC555 PowerPC, 139onboard A/D conversion, 99–101peripherals, 96–97power-saving capability, 101–3power supply, 2protocols, 143PWM output, 108–9with SAE J1850, 135–36SCI, 97sensor information into, 71–91for sensor interface, 85, 96–104single-chip, 95with smart-power ICs, 260SPI, 97STOP mode, 102–3timers, 97TPU, 105voltage/current regulation, 103Microdynamometers, 208–9defined, 208illustrated, 209photodiodes, 208Microelectromechanical system(MEMS),201–23, 267actuators, 203–11CAD and, 325–26cooling channels, 211–12defined, 1, 11, 201