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to temperaturetransducerand<br />

te_llperaturere_____ _r.ut<br />

_" _ > 10mm frOmde_OP of<br />

wall clearance_ 10mm _bm assembly to include<br />

F _-1 '. i' I N _ 10 TFOT pans<br />

I I , I I.=T_-..-._ supported on shelf or<br />

1 '1 I' I m standards.<br />

provide at least 5 nun _ ! ] t , , ] _ Entire assembly shall<br />

clearanceto nearest _ _--_ I ,' ' I I _ be removeable as an<br />

surface _.l ! U integral unR"<br />

_.mbly support _ _-I I ,' ' J, I M<br />

po.,<br />

Note 1: Distance a controls the levelness of the pans. The assembly shall be supported at three<br />

or more support points. The distance a, measured from each assembly support point<br />

to the bottom of the pan (top of shelf or pan support point), shall be controlled to<br />

+ 0.05 nun. Provision shall be made to ensure that the bottom of the vessel is leveled<br />

so that the thickness of the binder in the pans varies by no more than + 0.05 mm<br />

across the diameter of any pan.<br />

Note 2: Distance b shall be such that any active portion of the temperature transducer is<br />

>__10 mm from the top surface of the vessel.<br />

Note 3: Distance c shall be > 12 ram.<br />

Figure 2. Location of Pans and Resistance Thermal Detector within Representative PAV<br />

70

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