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Numonyx <strong>Wireless</strong> <strong>Flash</strong> <strong>Memory</strong> (<strong>W30</strong>)<br />
Contents<br />
1.0 Introduction .............................................................................................................. 7<br />
1.1 Document Purpose .............................................................................................. 7<br />
1.2 Nomenclature ..................................................................................................... 7<br />
1.3 Conventions ....................................................................................................... 8<br />
2.0 Functional Overview..................................................................................................9<br />
2.1 Overview ........................................................................................................... 9<br />
2.2 <strong>Memory</strong> Map and Partitioning.............................................................................. 10<br />
3.0 Package Information ............................................................................................... 13<br />
3.1 <strong>W30</strong> <strong>Flash</strong> <strong>Memory</strong> Device – 130 nm Lithography .................................................. 13<br />
3.2 <strong>W30</strong> <strong>Flash</strong> <strong>Memory</strong> Device – 180 nm Lithography .................................................. 15<br />
4.0 Ballout and Signal Descriptions ............................................................................... 18<br />
4.1 Signal Ballout ................................................................................................... 18<br />
4.2 Signal Descriptions ............................................................................................ 20<br />
5.0 Maximum Ratings and Operating Conditions............................................................ 24<br />
5.1 Absolute Maximum Ratings................................................................................. 24<br />
5.2 Operating Conditions ......................................................................................... 24<br />
6.0 Electrical Specifications........................................................................................... 26<br />
6.1 DC Current Characteristics.................................................................................. 26<br />
6.2 DC Voltage Characteristics.................................................................................. 27<br />
7.0 AC Characteristics ................................................................................................... 28<br />
7.1 Read Operations - 130 nm Lithography ................................................................ 28<br />
7.2 Read Operations - 180 nm Lithography ................................................................ 29<br />
7.3 AC Write Characteristics ..................................................................................... 38<br />
7.4 Erase and Program Times................................................................................... 43<br />
8.0 Power and Reset Specifications ............................................................................... 44<br />
8.1 Active Power..................................................................................................... 44<br />
8.2 Automatic Power Savings (APS) .......................................................................... 44<br />
8.3 Standby Power.................................................................................................. 44<br />
8.4 Power-Up/Down Characteristics........................................................................... 44<br />
8.4.1 System Reset and RST#.......................................................................... 45<br />
8.4.2 VCC, VPP, and RST# Transitions............................................................... 45<br />
8.5 Power Supply Decoupling ................................................................................... 45<br />
8.6 Reset Specifications........................................................................................... 46<br />
8.7 AC I/O Test Conditions....................................................................................... 46<br />
8.8 <strong>Flash</strong> Device Capacitance ................................................................................... 47<br />
9.0 <strong>Flash</strong> Device Operations .......................................................................................... 48<br />
9.1 Bus Operations ................................................................................................. 48<br />
9.1.1 Read .................................................................................................... 48<br />
9.1.2 Burst Suspend ....................................................................................... 49<br />
9.1.3 Standby ................................................................................................ 49<br />
9.1.4 Reset.................................................................................................... 50<br />
9.1.5 Write .................................................................................................... 50<br />
9.2 <strong>Flash</strong> Device Commands..................................................................................... 50<br />
9.3 Command Sequencing ....................................................................................... 53<br />
10.0 Read Operations ...................................................................................................... 55<br />
10.1 Read Array ....................................................................................................... 55<br />
November 2007 Datasheet<br />
Order Number: 290702-13 3