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CHEMICAL VAPOR DEPOSITION OF THIN FILM MATERIALS FOR ...

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MgAl2O4, the Ms value decrease with increasing deposition temperature, which might result from<br />

interface diffusion of Mg elements at high temperatures. The in plane FMR line width of these<br />

films range from 900 to 1100 Oe showing decreasing trend with increasing temperature. The<br />

improved surface roughness at high temperatures might contribute to the smaller FMR line width.<br />

Annealing of these as deposited films at 1000˚C in air for certain time range (2 and 4 hrs) has<br />

also been carried out to monitor the FMR line width change. All the films after annealing show<br />

increased FMR line width, which is different from those reported results of PLD deposited nickel<br />

ferrite films on MgO(111) substrate.[101]<br />

Fig. 55. Epitaxial growth of nickel ferrite films on SrTiO3 (100), PMN-PT (100) and PZN-PT(100) substrates at<br />

600˚C measured by XRD θ-2θ scan. Peaks with * are from (h00) reflections of the underlying substrates.<br />

Nickel ferrite thin film growth on piezoelectric (ferroelectric) substrates SrTiO3 (100),<br />

PMN-PT (100) and PZN-PT (100) are also investigated. All of these materials have a perovskite<br />

structure with lattice constants of 3.905, 4.023, and 4.06 (for ideal cubic phase). The<br />

corresponding lattice mismatch of nickel ferrite to these substrates are 6.4%, 3.5% and 2.5%,<br />

respectively. DLICVD of nickel ferrite on these substrates have been carried out at 600˚C.<br />

Epitaxial growth of nickel ferrite films has been observed, as shown in Fig.55. Film growth rate<br />

around 700 nm/hr is achieved by using the same vaporizer conditions as deposition on MgAl2O4.<br />

99

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