07.08.2013 Views

CHEMICAL VAPOR DEPOSITION OF THIN FILM MATERIALS FOR ...

CHEMICAL VAPOR DEPOSITION OF THIN FILM MATERIALS FOR ...

CHEMICAL VAPOR DEPOSITION OF THIN FILM MATERIALS FOR ...

SHOW MORE
SHOW LESS

You also want an ePaper? Increase the reach of your titles

YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.

indicated by the complex FMR curve............................................................................................42<br />

Fig. 18. Schematic of a previously reported DLI-CVD system for nickel ferrite growth.............43<br />

Fig. 19. Unit cell of perovskite BaTiO3 crystal.............................................................................45<br />

Fig. 20. Schematic of a β-diketonate precursor. R' and R'' represent the same or different<br />

alkyl groups....................................................................................................................................46<br />

Fig. 21. Molecular structure of TDMAH.......................................................................................49<br />

Fig. 22. Experimental setup of the in-situ ATR-FTIR...................................................................50<br />

Fig. 23. Experimental and theoretical modeled IR spectrum of TDMAH.....................................54<br />

Fig. 24. IR spectra of TDMAH adsorption on hydrogenated Si(100) at different Ts....................54<br />

Fig. 25. Integrated C-H stretching area change with TDMAH (a) adsorption and (b)<br />

desorption time at different substrate temperatures.......................................................................56<br />

Fig. 26. Change of ratio of peak 2770 cm -1 to the whole C-H stretching area in the period of<br />

adsorption and desorption at different substrate temperatures......................................................58<br />

Fig. 27. Surface Si-H bonds change with TDMAH adsorption and desorption at different<br />

crystal temperatures......................................................................................................................59<br />

Fig. 28. Surface OH group showing up in the desorption/pumping process (150˚C)..................59<br />

Fig. 29. Schematic of the plasma enhanced atomic layer deposition system................................61<br />

Fig. 30. ALD/CVD thin film deposition cluster coupled with in vacuo XPS...............................61<br />

Fig. 31. LabVIEW program for the control of PEALD process....................................................63<br />

Fig. 32. Synchronized reactants and plasma pulsing sequence in PEALD experiments...............63<br />

Fig. 33. The effect of purging time on oxygen incorporation........................................................65<br />

Fig. 34. XPS depth profile analysis of (a) Hf4f (b) N1s and (c) C1s in an as deposited<br />

HfNxCy thin film. Sample prepared at 250˚C, 0.15 torr, 100W.....................................................66<br />

Fig. 35. (a)Cross sectional view of HfNxCy on SiO2/Si (b)HRTEM images of HfNxCy-SiO2<br />

and SiO2-Si interfaces (c) surface topography by AFM, RMS roughness is 0.8nm......................69<br />

Fig. 36. X-ray reflectivity measurement of the as-deposited HfNxCy films at different plasma<br />

powers. The number of cycles are 200, 200, and 300 for 50, 100, and 150W, respectively..69<br />

xvi

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!