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CHEMICAL VAPOR DEPOSITION OF THIN FILM MATERIALS FOR ...

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6.1 Conclusion<br />

CHAPTER 6. CONCLUSION AND FUTURE WORK<br />

Chemical vapor deposition (CVD) of thin film materials with excellent electronic or<br />

magnetic properties has been investigated in this dissertation. Specific CVD techniques including<br />

plasma enhanced atomic layer deposition (PEALD) and direct liquid injection CVD (DLI-CVD)<br />

have been employed based on the requirements of practical thin film application. The essential<br />

work consists of chemical precursor selection and characterization, CVD processing, and thin<br />

film characterization. The results of thin film characterization could provide important<br />

information for the optimization of CVD processing conditions and thus in turn to improve the<br />

thin film quality. The results of PEALD of hafnium nitride (HfN), DLI-CVD of nickel ferrite<br />

(NiFe2O4), lithium ferrite (LiFe5O8), and barium titanate (BaTiO3) are summarized below.<br />

6.1.1 PEALD of HfN thin films<br />

Tetrakis (dimethylamido) hafnium (IV) (TDMAH) is used as the metal organic precursor<br />

for PEALD of HfN thin film. Its adsorption and reaction on hydrogenated Si(100) surface has<br />

been investigated by in-situ ATR-FTIR. It has been found that for temperatures below 100˚C,<br />

physisorption is the main mode of TDMAH adsorbing onto the crystal surface and no obvious<br />

surface Si-H bonds breaking. These physisorbed TDMAH molecules have weak bonding energy<br />

to the surface and easy to desorb. At temperatures between 100˚C and 150˚C, surface adsorbed<br />

TDMAH molecules start to decompose and newly emerging IR peaks at 1591 cm -1 and 1639 cm -<br />

1 are assigned to N=C and Hf-H vibrational mode respectively based on a β-hydride elimination<br />

mechanism. The decomposition species on the surface has been found hard to desorb at 150˚C,<br />

114

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