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CHEMICAL VAPOR DEPOSITION OF THIN FILM MATERIALS FOR ...

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solution was accurately controlled by a Brooks Quantim liquid MFC (10 g/h, full range)<br />

connected to the DLI200 vaporizer system. Ultrahigh purity argon gas was used as the carrier gas,<br />

which served both as the vaporization medium and the delivery gas. The liquid vaporization<br />

process is accelerated by a sequential input of mechanical and thermal energy. At the vaporizer<br />

inlet, where the liquid and carrier gas flow intersect, is an atomizer, which breaks up the entering<br />

fluid into fine droplets (2~5μm) because of a large pressure drop. Efficient heat and mass<br />

transport between the fine droplets and the preheated carrier gas (Ar) results in the metal-organic<br />

precursors being homogenously entrained in the solvent vapor and carried into the reactor<br />

without premature decomposition. Ultrahigh purity oxygen was used as the oxidant. Atomically<br />

polished single crystals such as MgAl2O4 (100) and MgO (100) of dimensions<br />

5mm×5mm×0.5mm from CrysTec Gmbh were used as substrates. Before loading into the reactor,<br />

the substrates were ultrasonically cleaned sequentially in acetone and isopropanol and then blow<br />

dried with N2. The vaporizer system was cleaned with pure DMF solvent after each run. Typical<br />

processing conditions are summarized in Table 4.<br />

Table 4. Typical processing conditions for DLI CVD of epitaxial NiFe2O4 films.<br />

Substrate MgAl2O4 (100) / MgO (100)<br />

Reaction pressure (Torr) 12<br />

Growth temperature (˚C) 500-800<br />

Concentration of solution (Fe(acac)3, mol/L) 0.067<br />

Solution flow rate (g/hr) 6<br />

Ar carrier gas flow rate (sccm) 300<br />

Vaporizer temperature (˚C) 175<br />

Oxygen flow rate (sccm) 300<br />

Prior to investigation of the CVD process conditions, we optimized the vaporizer<br />

operation parameters (including precursor solution injection rate, carrier gas (Argon) flow rate,<br />

vaporizer temperature, inlet and outlet pressures) by inspecting the surface morphology and<br />

76

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