Asymmetric fluid-structure dynamics in nanoscale imprint lithography

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List of TablesTable 2.1 Time required to reach desired base layer thickness with constant forceapplication for the case of a flat, square template.........................................38Table 5.1 Mechanical system stiffness values......................................................65Table 5.2 Simulation Parameters Reflecting Experimental Setup .......................69Table 6.1 PIDL parameters, recommended and actual settings for the C-842.....83Table 6.2 Parameters passed to the C-842 onboard s-curve profile generator.....83x
List of FiguresFigure 1.1 Optical microlithography process.........................................................5Figure 1.2 Step and flash imprint lithography process ........................................10Figure 1.3 Ratio of line height to base layer thickness ........................................12Figure 1.4 Base layer types ..................................................................................13Figure 2.1 Continuity of flow in an infinitesimal fluid element ..........................22Figure 2.2 Force equilibrium of an infinitesimal fluid element ...........................24Figure 2.3 Two flats showing orientation alignments..........................................27Figure 2.4 Parallel-surface squeeze film flow......................................................28Figure 2.5 Inclined-surface squeeze film flow.....................................................30Figure 2.6 Two-dimensional pressure distribution ..............................................34Figure 2.7 Gap height as a function of time for a flat, square template...............37Figure 2.8 Idealized template topography............................................................40Figure 3.1 Wafer stage assembly .........................................................................44Figure 3.2 Motion requirement for template orientation .....................................44Figure 3.3 Multi-imprint α-β template orientation stages ...................................45Figure 3.4 One degree-of-freedom template orientation stage ............................45Figure 3.5 Actuation leg.......................................................................................47Figure 3.6 Distributed flexure ring.......................................................................47Figure 3.7 Initial and final desired orientation with three-point control..............48Figure 3.8 Active stage prototype, side view.......................................................50Figure 4.1 Interference effect...............................................................................55Figure 4.2 Normalized intensity of a 500 nm film as a function of wavelength..56Figure 4.3 Normalized intensity of a 500 nm film as a function of wavenumber57Figure 4.4 PSD of theoretical reflectivity signal with a 500 nm thickness..........58Figure 5.1 Lumped Parameter Model ..................................................................60xi
Page 3 and 4: Asymmetric Fluid-StructureDynamics
Page 5 and 6: AcknowledgementsFirst of all, I wou
Page 7 and 8: Table of ContentsList of Tables ...
Page 9: 6.2.3 Control Software ............
Page 13 and 14: Figure 6.9 Force due to fluid press
Page 15 and 16: The exponential escalation in the c
Page 17 and 18: 1.2.1 Optical Lithography Process O
Page 19 and 20: patterns to the desired specificati
Page 21 and 22: 1.3 STEP AND FLASH IMPRINT LITHOGRA
Page 23 and 24: transferlayerwaferStep 1: Spin-coat
Page 25 and 26: the etch barrier fluid has an infin
Page 27 and 28: Researchers at the University of Te
Page 29 and 30: stage development. Design requireme
Page 31 and 32: minimum and maximum base layer thic
Page 33 and 34: square plate with fluid completely
Page 35 and 36: 7. The fluid is assumed incompressi
Page 37 and 38: ⎛ ∂ ⎞⎜τdz ⎟dxdy⎝+ τ
Page 39 and 40: where V 1 and V 2 correspond to U 1
Page 41 and 42: ddx⎛⎜h⎝3dp ⎞ ∂h⎟ = 12µ
Page 43 and 44: dhdtLzhθh αh βxx αx = 0 x βFig
Page 45 and 46: C2hhtanθ2 21= αxαxβxαxβ( ) (
Page 47 and 48: ⎛⎜ hD⎜⎝6C ⎞1tanθ⎟24µh
Page 49 and 50: at the plate edges. Freeland obtain
Page 51 and 52: For the case of 10 psi of pressure,
Page 53 and 54: are the same as the width of the tr
Page 55 and 56: orientation stages relative to the
Page 57 and 58: Wafer ChuckAir SolenoidMounting Pla
Page 59 and 60: The one degree-of-freedom template
Page 61 and 62:
Figure 3.7 Initial and final desire
Page 63 and 64:
7645321Figure 3.8 Active stage prot
Page 65 and 66:
Chapter 4: Real-Time Gap Sensing Vi
Page 67 and 68:
R( λ)( 4πnd/ λ)2 2 −2αd−αd
Page 69 and 70:
Rate Monitoring and is adapted for
Page 71 and 72:
10090807060PSD504030201000 500 1000
Page 73 and 74:
the multi-imprint and active stage
Page 75 and 76:
5.2.2 Composite Stiffness and Dampi
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( )2πR−1.5clamping length of 1.5
Page 79 and 80:
65actuator height, micron432100 0.1
Page 81 and 82:
time marching is required to minimi
Page 83 and 84:
5.4 SQUEEZE FILM DYNAMICS OF INCLIN
Page 85 and 86:
force, lb504540353025201510500 0.05
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improve upon these results by tunin
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Again, Figure 5.12 shows that a bas
Page 91 and 92:
optically flat quartz plate coated
Page 93 and 94:
optic probe was illuminated with a
Page 95 and 96:
Figure 6.3 Screenshot of control so
Page 97 and 98:
6.3 EXPERIMENTAL PROCEDUREExperimen
Page 99 and 100:
film thickness, nm40003800360034003
Page 101 and 102:
Figure 6.6 shows that the force due
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similar. In Figures 6.7 and 6.8, th
Page 105 and 106:
500045004000film thickness, nm35003
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Figure 6.13 shows the force-time pl
Page 109 and 110:
⎛ n ⎞in the FFT that is not ind
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when measuring thin layers in the r
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is a major milestone. The next step
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7.2.4 Control schemeThe ultimate go
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Assuming the liquid perfectly wets
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ase h (for a semi-circular notch,h
Page 121 and 122:
Chou, S. Y., P .R. Krauss, and P. J
Page 123 and 124:
Tripp, J. H. 1983. Surface roughnes
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Asymmetric fluid-structure dynamics in nanoscale imprint lithography

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