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Asymmetric fluid-structure dynamics in nanoscale imprint lithography

Asymmetric fluid-structure dynamics in nanoscale imprint lithography

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template and the wafer. As a part of the research for this thesis, an active stagetest bed is be<strong>in</strong>g developed. The motion capability of the active stage system isbased on the ideal Revolute Prismatic Ball (RPB) stage. The RPB platform hasbeen thoroughly analyzed [Johnson 1999].The systems that make up this test bed are 1) a wafer stage assembly, 2)template orientation stages 3) a micro-<strong>fluid</strong>ic etch barrier dispens<strong>in</strong>g system, 4) ahigh-resolution actuation system, 5) a gap sens<strong>in</strong>g/orientation measurementsystem, and 6) a force measurement system. Each system must be designed orpurchased as a modular component so that design modifications can beimplemented or customized with<strong>in</strong> reasonable costs and time constra<strong>in</strong>ts. Thefollow<strong>in</strong>g discussion will provide some <strong>in</strong>sight <strong>in</strong>to the design requirements of thesubsystems relevant to this research. The details of the gap sens<strong>in</strong>g theory andimplementation are given <strong>in</strong> chapter 4. A complete discussion of the entire activestage project is beyond the scope of this thesis, as the active stage test bed iscurrently <strong>in</strong> its <strong>in</strong>fancy stage.3.2.1 Wafer Stage AssemblyThe wafer stage must br<strong>in</strong>g the wafer substrate to with<strong>in</strong> the motion rangeof the DC Mike motor and hold the wafer <strong>in</strong> place dur<strong>in</strong>g impr<strong>in</strong>t<strong>in</strong>g. The waferchuck must hold the wafer with m<strong>in</strong>imal distortion by provid<strong>in</strong>g a uniformpressure across the backside of the wafer. Current wafer manufacturers providewafers with low frequency height variations across their diameter. Us<strong>in</strong>g a flatvacuum wafer chuck with uniform pressure across the support<strong>in</strong>g surface canm<strong>in</strong>imize these oscillations. Figure 3.1 shows the current embodiment of thewafer stage assembly. Air solenoids lift the wafer to with<strong>in</strong> the motion range ofthe actuation system.43

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