Asymmetric fluid-structure dynamics in nanoscale imprint lithography

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ReferencesBailey, T., B. J. Choi, M. Colburn, M. Meissl, S. Shaya, J.G. Ekerdt, S.V.Sreenivasan, and C.G. Willson. 2000. Step and flash imprint lithography:Template surface treatment and defect analysis. J. Vac. Sci. Technol. B 18(6):3572-77.Bhushan, B. Principles and Applications of Tribology. New York: John Wiley &Sons, 1999.Bhushan, B. Handbook of Micro/Nano Tribology. New York: CRC Press, 1995.Bouldin, C.E., W. E. Wallace, G.W. Lynn, S.C. Roth, and W.L. Wu. 2000.Thermal expansion coefficients of low-k dielectric films from Fourier analysis ofx-ray reflectivity. J. Appl. Phys., 88(2): 691-95.Cameron, A. Basic Lubrication Theory. New York: John Wiley & Sons, 1976.Chalmers, S. United States Patent No. 6,204,922 B1 Issued: 3/2001. Rapid andaccurate thin film measurement of individual layers in a multi-layered orpatterned sample. Assignee: Filmetrics, Inc., San Diego, CA.Chason, E. 2000. Use of kSA MOS system for stress and thickness monitoringduring CVD growth. Brown University.Choi, B. J., S. Johnson, and S.V. Sreenivasan. 1999. A high resolution imprintlithography machine for patterning flat and curved substrates, Department ofMechanical Engineering, The University of Texas at Austin. DARPA InterimReport.Choi, B.J, S. Johnson, S.V. Sreenivasan, M. Colburn, T. Bailey, and C.G.Willson. 2000. Partially constrained compliant stages for high resolution imprintlithography. Proceedings of DETC 2000: ASME Design Engineering TechnicalConference, Baltimore, MD.107
Chou, S. Y., P .R. Krauss, and P. J. Renstrom. 1996. Nanoimprint lithography. J.Vac. Sci. Technol B 14(6): 4129-33.Colburn, M. “Step and Flash Imprint Lithography: A Low-Pressure, RoomTemperature Nanoimprint Lithography.” Ph.D. dissertation, The University ofTexas at Austin, 2001.Colburn, M., S. Johnson, M. Stewart, S. Damle, T. Bailey, B. Choi, M. Wedlake,T. Michaelson, S.V. Sreenivasan, J. Ekerdt, and C. G. Willson. Step and flashimprint lithography: A novel approach to imprint lithography. SPIE 1999 AnnualInternational Symposium on Microlithography.Collis, S. S. An Introduction to Numerical Analysis for Computational FluidMechanics. Course notes. Department of Mechanical Engineering and MaterialsScience, Rice University, Houston, TX, 2000.Freeland, A. C. “Mathematical modeling of the dynamics and production ofbiosensors.” Ph.D. dissertation, The University of Texas at Austin, 2000.Haisma, J., M. Verheijan, K. Heuvel, and J. Berg. 1996. Mold-assistednanolithography: A process for reliable pattern replication. J. Vac. Sci Technol. B14(6): 4124-28.Hays, D.F. 1962. Squeeze films for rectangular plates. ASME Paper No. 62-Lub-S-9.Huibers, P. 1997. Models for the wavelength dependence of the index ofrefraction of water. Applied Optics. 36(16): 3785-87.Johnson, S.C. 1999. Selectively compliant orientation stages for imprintlithography. M.S. Thesis, Mechanical Engineering, The University of Texas,Austin.108
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Asymmetric Fluid-StructureDynamics
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AcknowledgementsFirst of all, I wou
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Table of ContentsList of Tables ...
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6.2.3 Control Software ............
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List of FiguresFigure 1.1 Optical m
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Figure 6.9 Force due to fluid press
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The exponential escalation in the c
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1.2.1 Optical Lithography Process O
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patterns to the desired specificati
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1.3 STEP AND FLASH IMPRINT LITHOGRA
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transferlayerwaferStep 1: Spin-coat
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the etch barrier fluid has an infin
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Researchers at the University of Te
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stage development. Design requireme
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minimum and maximum base layer thic
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square plate with fluid completely
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7. The fluid is assumed incompressi
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⎛ ∂ ⎞⎜τdz ⎟dxdy⎝+ τ
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where V 1 and V 2 correspond to U 1
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ddx⎛⎜h⎝3dp ⎞ ∂h⎟ = 12µ
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dhdtLzhθh αh βxx αx = 0 x βFig
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C2hhtanθ2 21= αxαxβxαxβ( ) (
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⎛⎜ hD⎜⎝6C ⎞1tanθ⎟24µh
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at the plate edges. Freeland obtain
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For the case of 10 psi of pressure,
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are the same as the width of the tr
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orientation stages relative to the
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Wafer ChuckAir SolenoidMounting Pla
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The one degree-of-freedom template
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Figure 3.7 Initial and final desire
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7645321Figure 3.8 Active stage prot
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Chapter 4: Real-Time Gap Sensing Vi
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R( λ)( 4πnd/ λ)2 2 −2αd−αd
Page 69 and 70: Rate Monitoring and is adapted for
Page 71 and 72: 10090807060PSD504030201000 500 1000
Page 73 and 74: the multi-imprint and active stage
Page 75 and 76: 5.2.2 Composite Stiffness and Dampi
Page 77 and 78: ( )2πR−1.5clamping length of 1.5
Page 79 and 80: 65actuator height, micron432100 0.1
Page 81 and 82: time marching is required to minimi
Page 83 and 84: 5.4 SQUEEZE FILM DYNAMICS OF INCLIN
Page 85 and 86: force, lb504540353025201510500 0.05
Page 87 and 88: improve upon these results by tunin
Page 89 and 90: Again, Figure 5.12 shows that a bas
Page 91 and 92: optically flat quartz plate coated
Page 93 and 94: optic probe was illuminated with a
Page 95 and 96: Figure 6.3 Screenshot of control so
Page 97 and 98: 6.3 EXPERIMENTAL PROCEDUREExperimen
Page 99 and 100: film thickness, nm40003800360034003
Page 101 and 102: Figure 6.6 shows that the force due
Page 103 and 104: similar. In Figures 6.7 and 6.8, th
Page 105 and 106: 500045004000film thickness, nm35003
Page 107 and 108: Figure 6.13 shows the force-time pl
Page 109 and 110: ⎛ n ⎞in the FFT that is not ind
Page 111 and 112: when measuring thin layers in the r
Page 113 and 114: is a major milestone. The next step
Page 115 and 116: 7.2.4 Control schemeThe ultimate go
Page 117 and 118: Assuming the liquid perfectly wets
Page 119: ase h (for a semi-circular notch,h
Page 123 and 124: Tripp, J. H. 1983. Surface roughnes
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