Asymmetric fluid-structure dynamics in nanoscale imprint lithography

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3.2 ACTIVE STAGE COMPONENTS ................................................................423.2.1 Wafer Stage Assembly..................................................................433.2.2 Template Orientation Stages.........................................................443.2.3 High-Resolution Actuation System ..............................................463.2.4 Force Sensing System ...................................................................493.3 IMPLEMENTED DESIGN ..........................................................................49Chapter 4: Real-Time Gap Sensing Via Fast Fourier Transforms of SpectralReflectivity........................................................................................524.1 INTRODUCTION ......................................................................................524.2 ANALYSIS OF SPECTRAL REFLECTIVITY ................................................53Chapter 5: Numerical Simulations....................................................................595.1 DYNAMIC SYSTEM MODEL .....................................................................595.2 SYSTEM PARAMETERS FOR NUMERICAL SIMULATION...........................615.2.1 Etch Barrier Fluid Properties ........................................................615.2.2 Composite Stiffness and Damping Coefficients ...........................625.3 NUMERICAL METHOD ............................................................................665.3.1 Fourth Order Accurate Runge-Kutta with Adaptive Time Step ...665.3.2 Modeling the Initial Conditions for an Imprint.............................685.4 SQUEEZE FILM DYNAMICS OF INCLINED SURFACE OF INFINITE WIDTH.705.4.1 Single S-Curve Motion Profile .....................................................705.4.2 Double S-Curve Motion Profile....................................................725.5 SQUEEZE FILM DYNAMICS OF PARALLEL, CIRCULAR PLATES...............75Chapter 6: Experimental Results ......................................................................776.1 INTRODUCTION ......................................................................................776.2 EXPERIMENTAL SETUP ..........................................................................776.2.1 Experimental Adaptations of the Active Stage Test Bed..............776.2.2 Data Acquisition Hardware...........................................................79viii
6.2.3 Control Software ...........................................................................806.3 EXPERIMENTAL PROCEDURE .................................................................846.4 EXPERIMENTAL RESULTS ......................................................................846.4.1 Verification of the Simulation Results by Experiments................846.4.2 Experiments with Unfiltered Water ..............................................906.4.3 Experiments with Filtered Water ..................................................926.4.4 Experimental Squeeze Film Force ................................................936.5 OBSERVATIONS AND DISCREPANCIES ....................................................946.5.1 Particle Contamination..................................................................946.5.2 Signal Processing ..........................................................................956.5.3 Template/Substrate Deformation ..................................................98Chapter 7: Closing Remarks..............................................................................997.1 SUMMARY OF RESEARCH .......................................................................997.2 FUTURE WORK ....................................................................................1007.2.1 Numerical Solution to the Generalized Reynolds Equation .......1007.2.2 Distributed parameter model of the mechanical system .............1017.2.3 Measurements with Patterned Templates....................................1017.2.4 Control scheme............................................................................102Appendix A: Axisymmetric Problem ..............................................................103Appendix B: Design of Semi-Circular Notched Flexures..............................105References……………………………………………………………………...107Vita……………………………………………………………………………..111ix
Page 3 and 4: Asymmetric Fluid-StructureDynamics
Page 5 and 6: AcknowledgementsFirst of all, I wou
Page 7: Table of ContentsList of Tables ...
Page 11 and 12: List of FiguresFigure 1.1 Optical m
Page 13 and 14: Figure 6.9 Force due to fluid press
Page 15 and 16: The exponential escalation in the c
Page 17 and 18: 1.2.1 Optical Lithography Process O
Page 19 and 20: patterns to the desired specificati
Page 21 and 22: 1.3 STEP AND FLASH IMPRINT LITHOGRA
Page 23 and 24: transferlayerwaferStep 1: Spin-coat
Page 25 and 26: the etch barrier fluid has an infin
Page 27 and 28: Researchers at the University of Te
Page 29 and 30: stage development. Design requireme
Page 31 and 32: minimum and maximum base layer thic
Page 33 and 34: square plate with fluid completely
Page 35 and 36: 7. The fluid is assumed incompressi
Page 37 and 38: ⎛ ∂ ⎞⎜τdz ⎟dxdy⎝+ τ
Page 39 and 40: where V 1 and V 2 correspond to U 1
Page 41 and 42: ddx⎛⎜h⎝3dp ⎞ ∂h⎟ = 12µ
Page 43 and 44: dhdtLzhθh αh βxx αx = 0 x βFig
Page 45 and 46: C2hhtanθ2 21= αxαxβxαxβ( ) (
Page 47 and 48: ⎛⎜ hD⎜⎝6C ⎞1tanθ⎟24µh
Page 49 and 50: at the plate edges. Freeland obtain
Page 51 and 52: For the case of 10 psi of pressure,
Page 53 and 54: are the same as the width of the tr
Page 55 and 56: orientation stages relative to the
Page 57 and 58: Wafer ChuckAir SolenoidMounting Pla
Page 59 and 60:
The one degree-of-freedom template
Page 61 and 62:
Figure 3.7 Initial and final desire
Page 63 and 64:
7645321Figure 3.8 Active stage prot
Page 65 and 66:
Chapter 4: Real-Time Gap Sensing Vi
Page 67 and 68:
R( λ)( 4πnd/ λ)2 2 −2αd−αd
Page 69 and 70:
Rate Monitoring and is adapted for
Page 71 and 72:
10090807060PSD504030201000 500 1000
Page 73 and 74:
the multi-imprint and active stage
Page 75 and 76:
5.2.2 Composite Stiffness and Dampi
Page 77 and 78:
( )2πR−1.5clamping length of 1.5
Page 79 and 80:
65actuator height, micron432100 0.1
Page 81 and 82:
time marching is required to minimi
Page 83 and 84:
5.4 SQUEEZE FILM DYNAMICS OF INCLIN
Page 85 and 86:
force, lb504540353025201510500 0.05
Page 87 and 88:
improve upon these results by tunin
Page 89 and 90:
Again, Figure 5.12 shows that a bas
Page 91 and 92:
optically flat quartz plate coated
Page 93 and 94:
optic probe was illuminated with a
Page 95 and 96:
Figure 6.3 Screenshot of control so
Page 97 and 98:
6.3 EXPERIMENTAL PROCEDUREExperimen
Page 99 and 100:
film thickness, nm40003800360034003
Page 101 and 102:
Figure 6.6 shows that the force due
Page 103 and 104:
similar. In Figures 6.7 and 6.8, th
Page 105 and 106:
500045004000film thickness, nm35003
Page 107 and 108:
Figure 6.13 shows the force-time pl
Page 109 and 110:
⎛ n ⎞in the FFT that is not ind
Page 111 and 112:
when measuring thin layers in the r
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is a major milestone. The next step
Page 115 and 116:
7.2.4 Control schemeThe ultimate go
Page 117 and 118:
Assuming the liquid perfectly wets
Page 119 and 120:
ase h (for a semi-circular notch,h
Page 121 and 122:
Chou, S. Y., P .R. Krauss, and P. J
Page 123 and 124:
Tripp, J. H. 1983. Surface roughnes
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Asymmetric fluid-structure dynamics in nanoscale imprint lithography

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