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Chapter VII Reactivity at Dislocation….<br />

current, voltage, time, nature and pressure of the gas and the arrangement of<br />

anode and cathode, the individual crystals of the sputtered surface may become<br />

smooth, showing only the grain boundaries, or they may be etched, showing<br />

structure within the crystals.<br />

7.3 Etching process<br />

When the rate of dissolution of a solid is rapid, the process is controlled by<br />

the rates of chemical and thermal diffusion in the solvent. As the dissolution rate<br />

or the under saturation of solvent becomes smaller, the surface imperfections of<br />

the solid play prominent role [12].<br />

Figure:7.1 Surface imperfection on a crystal.<br />

The unit process in dissolution can be considered as a removal of a molecule<br />

from the corner of a kink in a surface step; however, the process occurs only if:<br />

(a) a step exists on the surface, (b) the step contains kinks and (c) the solvent is<br />

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