Design Challenges: Avoiding the Pitfalls, winning the game - Xilinx

Product Selection Matrix – 9500 Series Package Options and User I/O
I/O
Features Speed Clocking
XC9500
XC9500XL
XC9500XV
XC95288
XC95216
XC95144
XC95108
XC9572
XC9536
XC95288XL
XC95144XL
XC9572XL
XC9536XL
XC95288XV
XC95144XV
XC9572XV
XC9536XV
Area 1
Pins
PLCC Packages (PC) – wire-bond plastic chip carrier (1.27 mm lead spacing)
34 34
34 34
34 34
17.5 x 17.5 mm
44
84 30.2 x 30.2 mm
69 69
Min. Pin-to-pin Logic Delay (ns)
PQFP Packages (PQ) – wire-bond plastic QFP (0.5 mm lead spacing)
Product Term Clocks per
Function Block
Global Clocks
IQ Speed Grade
Industrial Speed Grades
(fastest to slowest)
Commercial Speed Grades
(fastest to slowest)
I/O Banking
Maximum I/O
Output Voltage Compatible
Input Voltage Compatible
Product Terms per Macrocell
Macrocells
System Gates
72 81 81
23.3 x 17.2 mm
100
160 31.2 x 31.2 mm
108 133 133
36 1 5 -5 -7 -7 NA 3 18
1.8/2.5/3.3
2.5/3.3
208 30.6 x 30.6 mm
168 168
166 168
72 1 5 -5 -7 -7 NA 3 18
1.8/2.5/3.3
2.5/3.3
VQFP Packages (VQ) – very thin TQFP (0.5 mm lead spacing)
44 12.0 x 12.0 mm 34 34 34 34
34
64 12.0 x 12.0 mm
36 52
117 2 5 -5 -7 -7 NA 3 18
192 4 6 -6 -7 -10 -7 -10 NA 3 18
1.8/2.5/3.3
2.5/3.3
1.8/2.5/3.3
2.5/3.3
XC9500XV Family – 2.5 Volt
XC9536XV 800 36 90
XC9572XV 1,600 72 90
XC95144XV 3,200 144 90
XC95288XV 6,400 288 90
81 81
72
TQFP Packages (TQ) – thin QFP (0.5 mm lead spacing)
100 16.0 x 16.0 mm 72 81 72 81
XC9500XL Family – 3.3 Volt
36 5 -5 -7 -10 -7 -10 -10 3 18
2.5/3.3
2.5/3.3/5
90
XC9536XL 800 36
114 Xcell Journal Third Quarter 2005
117 117 117 117
22.0 x 22.0 mm
144
72 5 -5 -7 -10 -7 -10 -10 3 18
2.5/3.3
2.5/3.3/5
90
XC9572XL 1,600 72
Chip Scale Packages (CS) – wire-bond chip-scale BGA (0.8 mm ball spacing)
90
XC95144XL 3,200 144
34
36 38
36 38
7 x 7 mm
48
117 5 -5 -7 -10 -7 -10 NA 3 18
192 6 -6 -7 -10 -7 -10 NA 3 18
2.5/3.3
2.5/3.3/5
117 117
12 x 12 mm
144
2.5/3.3
2.5/3.3/5
90
XC95288XL 6,400 288
192 192
16 x 16 mm
280
XC9500 Family – 5 Volt
BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)
36 10 -5 -6 -10 -15 -7 -10 -15 -15 3 18
90
XC9536 800 36
192
27 x 27 mm
256
72 10 -7 -10 -15 -10 -15 -15 3 18
90
XC9572 1,600 72
352 35.0 x 35.0 mm
166 192
90
XC95108 2,400 108
FBGA Packages (FG) – wire-bond Fine-line BGA (1.0 mm ball spacing)
108 10 -7 -10 -15 -20 -7 -10 -15 -20 NA 3 18
133 10 -7 -10 -15 -10 -15 NA 3 18
5
5
5
5
5
5
5
5
90
XC95144 3,200 144
192 192
17 x 17 mm
256
Note 1: Area dimensions for lead-frame products are inclusive of the leads.
XC95216 4,800 216 90 5 5 166 10 -10 -15 -20 -10 -15 -20 NA 3 18
288 90 5 5 192 10 -10 -15 -20 -15 -20 NA 3 18
XC95288 6,400
Pb-free solutions are available. For more information about Pb-free solutions visit www.xilinx.com/pbfree
Xilinx CPLD
www.xilinx.com/devices/