FONTARGEN A/AF 314

FONTARGEN AP 644/12Lead free highly activating tin copper solder pasteDIN EN 29453: S-Sn97 Cu3 / Alloy-no. 24Composition, typical analysis (% w/w):CuSn3,0 RestMechanical and physical properties:Working temperature: 300°CMelting range: 230 – 250°CElectrical conductivity:8,5 Sm/mm²Specific weight:7,3 g/cm³ (metal content)Characteristics / Applications:The lead and cadmium free solder paste AP 644/12 contains a highly activating andcorrosive flux. The flux residues are corrosive and must be removed. Used for tin coatingand soldering of metal products. The paste is suitable for products used in the foodindustry. The paste must be well stirred before using.Flux residues can be removed with hot water.Heat sources:Oxyacetylene torch (excess of fuel gas), Gas-air torch, soldering iron, soldering lampFlux:3.1.1 acc. DIN EN 29454.1Storage:Keep sealed, under stable temperatures in dry rooms. Optimum temperature range isbetween 5 and 20°C. Stir well before use.Shelf life:6 Mo. in pots; 3 Mo. in cartridges >175 ccm; 6 Weeks in cartridges