Data Sheet - Freescale Semiconductor

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BUS_I Cmd_Start Cmd_Valid Cmd_Block VHigh_Samp BUS_I Cmd_Start Cmd_Valid Cmd_Block VHigh_Samp MMA27XXW t Cmd_Valid t CmdBlock_CRM t CmdBlock_ST_CRM Figure 29. DSI3 Command receiver timing diagram: Valid command t Cmd_Valid Figure 30. DSI3 Command receiver timing diagram: Microcut Sensors 56 Freescale Semiconductor, Inc. t t
3.6.2 Response transmitter The response transmitter block converts two digital signals into two supply modulation currents. The response currents are generated such that the rise and fall times are the same whether the I RESP current is being transmitted or the 2 x I RESP current is being transmitted. A diagram of the response transmitter is shown in Figure 29. Current values and timing parameters are specified in Section 2.3 and Section 2.7. 3.6.3 Discovery Mode current sense Figure 31. DSI3 transmitter block diagram The current sense circuit is used during Discovery Mode to determine if any additional slaves are connected to the BUS_O pin of the device. A diagram of the current sense circuit is shown in Figure 32. Current values and timing parameters are specified in Section 2.3 and Section 2.7. Details regarding Discovery Mode are included in Section 4.1.3. BUS_I BUS_O V HIGH V LOW I CCQ_SAMPLE I RESP Activation Disc_Compare R SENSE Amp t Disc_Dly Transmit Level ‘0’ Transmit Level ‘1’ Transmit Level ‘2’ Magnitude Control Slew Control Figure 32. Discovery Mode current sense circuit block diagram t IDiscsamp_Dly I OUT I CCQ Sample & Hold t Disc_Iccqsamp I CCQ Sample t IDiscsamp - + - Figure 33. DSI3 Discovery Mode sensing timing diagram MMA27XXW Sensors Freescale Semiconductor, Inc. 57 I REF I CCQ I DISC >0? Disc_Compare I DATA V SS Disc_Command_Rcvd Control Logic AddrCount LastDevice t
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Freescale Semiconductor Document Nu
Page 3 and 4:
1 Block Diagram, Pin Descriptions,
Page 5 and 6: 1.3 Application diagram C2 C3 C4 Ta
Page 7 and 8: 2 Electrical Characteristics 2.1 Ma
Page 9 and 10: 2.4 Electrical Characteristics - se
Page 11 and 12: 2.6 Dynamic electrical characterist
Page 13 and 14: 2.8 Dynamic electrical characterist
Page 15 and 16: 3.1.1 IC Type register The IC Type
Page 17 and 18: 3.1.9 Device Serial Number register
Page 19 and 20: 3.1.13.3 Clock Calibration Enable (
Page 21 and 22: 3.1.15.4 Periodic Data Collection M
Page 23 and 24: 3.1.19.2 Oscillator Training Error
Page 25 and 26: 3.1.19.14 BUS IN Undervoltage Error
Page 27 and 28: 3.1.22 DSI3 Communication CRC Polyn
Page 29 and 30: 3.1.25.1 Low-pass filter selection
Page 31 and 32: 3.1.28 Reserved Registers A registe
Page 33 and 34: 3.3 Voltage regulators The device d
Page 35 and 36: BUS_I V BUF V REG V REGA I DATA POR
Page 37 and 38: 3.4 Internal oscillator The device
Page 39 and 40: 3.5.2 Self-test interface The self-
Page 41 and 42: 3.5.4.1 Decimation Sinc filter The
Page 43 and 44: Figure 17. Low-pass filter characte
Page 49 and 50: 3.5.4.4 Signal compensation The dev
Page 51 and 52: Figure 24. 10 Hz offset cancellatio
Page 53 and 54: Figure 26. 0.1 Hz offset cancellati
Page 55: 3.6 DSI3 physical layer 3.6.1 Comma
Page 59 and 60: 3.7.2 Synchronous Sampling mode wit
Page 61 and 62: 4 DSI3 Protocol The DSI3 standard d
Page 63 and 64: 4.2.1.1 Bit encoding Figure 41 show
Page 65 and 66: 4.2.2.1 Symbol Encoding The device
Page 67 and 68: 4.2.3 DSI3 Command and Response Mod
Page 69 and 70: 4.2.4.2 Register Write Command The
Page 71 and 72: 4.2.4.4 Enter Periodic Data Collect
Page 73 and 74: 4.3.2 DSI3 Periodic Data Collection
Page 75 and 76: 4.3.3 DSI3 Periodic Data Collection
Page 77 and 78: 4.4 Maximum number of devices on a
Page 79 and 80: 6 Recommended Footprint Reference F
Page 81 and 82: CASE 2086-01 ISSUE C 16 LEAD QFN MM
Page 83 and 84: 8 Revision History Table 69. Revisi
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Data Sheet - Freescale Semiconductor

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