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FIBEROPTIC SENSOR TECHNOLOGY HANDBOOK

FIBEROPTIC SENSOR TECHNOLOGY HANDBOOK

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I<br />

in one portion of the recombination layer but not in<br />

another. ‘Lhis is known as filamentary lasing. Such<br />

lasing behavior tends to produce noise. If the width<br />

of the layer is less than 10 microns, it is too narrow<br />

for such filamentary behavior to occur and when lasing<br />

does begin it occura uniformly throughout the layer.<br />

Furthermore, when the width is less than 15 microns<br />

singlemode propagation usually occurs. Finally, the<br />

less the width of the recombination layer the less the<br />

required threshold current. Double-heterojunction diode<br />

lasers with threshold currents as low as 20 ma have<br />

been produced. However, trade-offs may be required.<br />

For example, reducing the recombination layer width<br />

also reduces the maximum safe photon intensity. A safe<br />

cw optical power output that can be maintained without<br />

danger of facet damage is approximately 1 mW for each<br />

micron of recombination layer width. Thus, a laser with<br />

a recombination layer 10 microns wide can produce 10 mW<br />

of optical power safely.<br />

A striped-geometry injection laser diode,<br />

such as that shown in Fig. 2.47, has the desired thin<br />

and narrow recombination region. With this geometry,<br />

the emitted light spreads out in the vertical direction<br />

by as much 50” and in the horizontal by 8° or more.<br />

The dimensions of the recombination layer are of the<br />

order of 0.3 microns thick, 10 microns wide, and Up to<br />

500 microns long. These dimensions and light spreading<br />

angles must be taken into account when the laser is<br />

coupled to an optical fiber or substrate.<br />

TRANSVERSE<br />

(m)<br />

u 1<br />

Y<br />

UDINAL (q)<br />

FUNDAMENTAL MODE<br />

{ (!:;)<br />

,-I 2ndMODE<br />

,’‘ ‘,,, (m::)<br />

~<br />

E LATERAL(s)<br />

DISTANCE<br />

Fig. 2.48 The light intensity as a function of distance<br />

across the face of a laser for the<br />

fundamental and second lightwave modes generated<br />

by a laser.<br />

METAL CONTACT<br />

-’”’<br />

P<br />

(a) STRIPE CONTACT<br />

METAL CONTACT<br />

)<br />

II(Zn-DIFFUSED)<br />

/[ n<br />

P<br />

N<br />

euBsTRATE<br />

(c) DOPING-PROFILE<br />

P<br />

METAL ~ONTACT<br />

PROTON<br />

SOMSARDED<br />

(SEMI t+SULATING)<br />

METAL CONTACT<br />

‘P<br />

-4 l-+=<br />

(b) PROTON-BOMBARDMENT<br />

(d) STRIPE MESA<br />

Fig. 2.49 End views of various stripe geometry diode<br />

lasers.<br />

Fig. 2.47<br />

A GsAs-GcAIAs geometry CW injection laser<br />

diode.<br />

The distribution of optical energy across the<br />

lasing region is shown in Fig. 2.48. The fundamental<br />

and second harmonic of the longitudinal modes are shown.<br />

In the longitudinal fundamental mode, the energy tends<br />

to be concentrated more heavily towards the center, and<br />

tapers off towards the edges in a Gaussian distribution<br />

curve. If this lasing region is sufficiently wide, the<br />

second harmonic mode can occur and the emitted optical<br />

energy is concentrated in two regions.<br />

Several techniques have been employed to fabricate<br />

such stripe geometry. Some of these are shown<br />

in Fig. 2.49. The upper left (a), an oxide protective<br />

stripe is shown between the metal contact and the crystal.<br />

The stripe is formed where the oxide layer is<br />

omitted in the center. Electrons tend to be injected<br />

into this region only. In this case, the current can<br />

spread out underneath the oxide layer where it is not<br />

confined. Another technique, shown at the lower left<br />

(b), reduces such current spreading by increasing the<br />

resistivity in the regions on each side of the stripe.<br />

This can be accomplished by photon bombardment that<br />

2-21<br />

produces a semi-insulating layer on each side of the<br />

stripe. A third technique, shown at the upper right<br />

(c), uses the diffusion of a dopant, such as zinc, into<br />

the stripe region to significantly lower the resisti-<br />

Vity. Finally, almost complete electric current conf<br />

inement occurs in the structure shown at the lower<br />

right, (d). A stripe mesa (plateau or table) such as<br />

this is formed during the process of growing the crystal.<br />

Often such a mesa is buried by depositing additional<br />

material over it.<br />

For diode laser operation one major concern<br />

has been the reduction of the spontaneous emission region<br />

that was shown in Fig. 2.49. However, spontaneous<br />

emission is the mechanism responsible for light emission<br />

in LED’s. These devices are cheaper. Simpler<br />

construction techniques may be used. The light they<br />

produce is not coherent and is emitted over a much<br />

wider angle (approximately 180° ) with the result that<br />

less optical power may be coupled into a fiber. On<br />

the other hand, the spontaneous emission portion of<br />

the optical output power versus input direct current<br />

curve is far less temperature dependent than the stimulated<br />

emission region. Thus , because LED’s are less<br />

temperature dependent than diode lasers, temperature<br />

control and optical feedback problems are reduced.

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