FIBEROPTIC SENSOR TECHNOLOGY HANDBOOK
FIBEROPTIC SENSOR TECHNOLOGY HANDBOOK
FIBEROPTIC SENSOR TECHNOLOGY HANDBOOK
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I<br />
in one portion of the recombination layer but not in<br />
another. ‘Lhis is known as filamentary lasing. Such<br />
lasing behavior tends to produce noise. If the width<br />
of the layer is less than 10 microns, it is too narrow<br />
for such filamentary behavior to occur and when lasing<br />
does begin it occura uniformly throughout the layer.<br />
Furthermore, when the width is less than 15 microns<br />
singlemode propagation usually occurs. Finally, the<br />
less the width of the recombination layer the less the<br />
required threshold current. Double-heterojunction diode<br />
lasers with threshold currents as low as 20 ma have<br />
been produced. However, trade-offs may be required.<br />
For example, reducing the recombination layer width<br />
also reduces the maximum safe photon intensity. A safe<br />
cw optical power output that can be maintained without<br />
danger of facet damage is approximately 1 mW for each<br />
micron of recombination layer width. Thus, a laser with<br />
a recombination layer 10 microns wide can produce 10 mW<br />
of optical power safely.<br />
A striped-geometry injection laser diode,<br />
such as that shown in Fig. 2.47, has the desired thin<br />
and narrow recombination region. With this geometry,<br />
the emitted light spreads out in the vertical direction<br />
by as much 50” and in the horizontal by 8° or more.<br />
The dimensions of the recombination layer are of the<br />
order of 0.3 microns thick, 10 microns wide, and Up to<br />
500 microns long. These dimensions and light spreading<br />
angles must be taken into account when the laser is<br />
coupled to an optical fiber or substrate.<br />
TRANSVERSE<br />
(m)<br />
u 1<br />
Y<br />
UDINAL (q)<br />
FUNDAMENTAL MODE<br />
{ (!:;)<br />
,-I 2ndMODE<br />
,’‘ ‘,,, (m::)<br />
~<br />
E LATERAL(s)<br />
DISTANCE<br />
Fig. 2.48 The light intensity as a function of distance<br />
across the face of a laser for the<br />
fundamental and second lightwave modes generated<br />
by a laser.<br />
METAL CONTACT<br />
-’”’<br />
P<br />
(a) STRIPE CONTACT<br />
METAL CONTACT<br />
)<br />
II(Zn-DIFFUSED)<br />
/[ n<br />
P<br />
N<br />
euBsTRATE<br />
(c) DOPING-PROFILE<br />
P<br />
METAL ~ONTACT<br />
PROTON<br />
SOMSARDED<br />
(SEMI t+SULATING)<br />
METAL CONTACT<br />
‘P<br />
-4 l-+=<br />
(b) PROTON-BOMBARDMENT<br />
(d) STRIPE MESA<br />
Fig. 2.49 End views of various stripe geometry diode<br />
lasers.<br />
Fig. 2.47<br />
A GsAs-GcAIAs geometry CW injection laser<br />
diode.<br />
The distribution of optical energy across the<br />
lasing region is shown in Fig. 2.48. The fundamental<br />
and second harmonic of the longitudinal modes are shown.<br />
In the longitudinal fundamental mode, the energy tends<br />
to be concentrated more heavily towards the center, and<br />
tapers off towards the edges in a Gaussian distribution<br />
curve. If this lasing region is sufficiently wide, the<br />
second harmonic mode can occur and the emitted optical<br />
energy is concentrated in two regions.<br />
Several techniques have been employed to fabricate<br />
such stripe geometry. Some of these are shown<br />
in Fig. 2.49. The upper left (a), an oxide protective<br />
stripe is shown between the metal contact and the crystal.<br />
The stripe is formed where the oxide layer is<br />
omitted in the center. Electrons tend to be injected<br />
into this region only. In this case, the current can<br />
spread out underneath the oxide layer where it is not<br />
confined. Another technique, shown at the lower left<br />
(b), reduces such current spreading by increasing the<br />
resistivity in the regions on each side of the stripe.<br />
This can be accomplished by photon bombardment that<br />
2-21<br />
produces a semi-insulating layer on each side of the<br />
stripe. A third technique, shown at the upper right<br />
(c), uses the diffusion of a dopant, such as zinc, into<br />
the stripe region to significantly lower the resisti-<br />
Vity. Finally, almost complete electric current conf<br />
inement occurs in the structure shown at the lower<br />
right, (d). A stripe mesa (plateau or table) such as<br />
this is formed during the process of growing the crystal.<br />
Often such a mesa is buried by depositing additional<br />
material over it.<br />
For diode laser operation one major concern<br />
has been the reduction of the spontaneous emission region<br />
that was shown in Fig. 2.49. However, spontaneous<br />
emission is the mechanism responsible for light emission<br />
in LED’s. These devices are cheaper. Simpler<br />
construction techniques may be used. The light they<br />
produce is not coherent and is emitted over a much<br />
wider angle (approximately 180° ) with the result that<br />
less optical power may be coupled into a fiber. On<br />
the other hand, the spontaneous emission portion of<br />
the optical output power versus input direct current<br />
curve is far less temperature dependent than the stimulated<br />
emission region. Thus , because LED’s are less<br />
temperature dependent than diode lasers, temperature<br />
control and optical feedback problems are reduced.