Microcomputer Circuits and Processes
Microcomputer Circuits and Processes
Microcomputer Circuits and Processes
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c 0<br />
) refresh<br />
nd<br />
utput-input<br />
ircuits<br />
transistors would do this job. Note that there is a common input <strong>and</strong><br />
output connection to the flip-flop; check for yourself that this works by<br />
putting a logic level 1 at this connection, <strong>and</strong> work out the logic states<br />
at the inputs <strong>and</strong> outputs of both inverters. Repeat for input logical O.<br />
Figure 4.3(a) shows how four of these cells are connected with switches.<br />
In reality, these switches are also transistors on an integrated chip <strong>and</strong><br />
are controlled by the row <strong>and</strong> column select logic. Data is written <strong>and</strong><br />
read via the line at the bottom of the diagram.<br />
You will realize that in a flip-flop one halfis on while the other is oft<br />
So two transistors are always at work. This type of memory needs a lot<br />
~ of current, but is fast. A 2147 chip needs about 55 ns (nanoseconds) to<br />
storage read or write a cell. More common RAM needs about 200 ns.<br />
capacitor<br />
V The second type of RAM memory cell is the dynamic RAM shown in<br />
I_______<br />
figure 4.4. Here the bit stored, 0 or 1,is stored as no charge, or charge on<br />
a capacitor. A single transistor, shown on the diagram as a switch, is<br />
needed to control the charging of this capacitor. At once you can se~<br />
that these dynamic cells are much simpler <strong>and</strong> smaller than static cells.<br />
Since they store information by storing charge, they do not need large<br />
operating currents. They score over static RAM, but there is a small<br />
problem: the charge on the capacitor leaks away, so special control<br />
circuitry has to be installed, to continually top-up the capacitors, or<br />
'refresh' them. This must happen every 20 ms or so. Refresh circuitry is<br />
Figure 4.4 complex to build, <strong>and</strong> dynamic RAM controllers, chips dedicated to<br />
A dynamic RAM cell is<br />
topping up the dynamic RAM capacitors, are not cheap. The expense of<br />
basically a capacitor whose<br />
charging is controlled by this extra circuitry is only recovered when large memory systems of<br />
a single transistor switch. hundreds of K are being built.<br />
Bubble memory - mega storage<br />
Figure 4.5<br />
Ferrite slice with weak perpendicular<br />
magnetic field showing domains.<br />
Bubble memory units with capacities of up to 4 megabits are the subject<br />
of research today. They are not semiconductor devices, but employ<br />
magnetic materials in their technology. This is not as hard to underst<strong>and</strong><br />
as semiconductor technology, so here is an outline of how a<br />
bubble memory works. It illustrates how physics has been applied in a<br />
high-engineering situation.<br />
You are probably familiar with the idea of magnetic domains found<br />
in all sorts of magnetic materials. When unmagnetized, the domains in<br />
the material are r<strong>and</strong>omly arranged in three dimensions, but as the<br />
material is slowly magnetized, the domain walls move so that most of<br />
the domains align to a common direction. When the material used is a<br />
thin film (0.01mm thick) of ferrite (a magnetic oxide of iron, with other<br />
metals), then the domains become two-dimensional, as shown in figure<br />
4.5.<br />
When the slice is immersed in a perpendicular magnetic field, the<br />
domains oriented oppositely to the field shrink in size. As the 'bias field'<br />
is increased, the few remaining domains become small cylinders, called<br />
'bubbles', as shown in figure 4.6.<br />
These bubbles are a few micrometres in size. If, in addition to the<br />
bias field, there is a small field which is weak in one place <strong>and</strong> strong in<br />
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