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PCT/2001/50 - World Intellectual Property Organization

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<strong>50</strong>/<strong>2001</strong><br />

23098 <strong>PCT</strong> Gazette - Section I - Gazette du <strong>PCT</strong> 13 Dec/déc <strong>2001</strong><br />

(72, 75) DELEONIBUS, Simon [FR/FR]; 40,<br />

allée des Giteaux, La Chanteraie, F-38640<br />

Claix (FR).<br />

(74) WEBER, Etienne; Brevatome, 3, rue du<br />

Docteur Lancereaux, F-7<strong>50</strong>08 Paris (FR).<br />

(81) JP US.<br />

(84) EP (AT BE CH CY DE DK ES FI FR GB GR<br />

IE IT LU MC NL PT SE TR).<br />

(51) 7 H01L 21/336, 21/768<br />

(11) WO 01/95384 (13) A1<br />

(21) <strong>PCT</strong>/GB01/02456<br />

(22) 4 Jun/juin <strong>2001</strong> (04.06.<strong>2001</strong>)<br />

(25) en (26) en<br />

(30) 0013473.4 3 Jun/juin 2000 GB<br />

(03.06.2000)<br />

(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />

(54) • A METHOD OF ELECTRONIC COM-<br />

PONENT FABRICATION AND AN<br />

ELECTRONIC COMPONENT<br />

• PROCEDE DE FABRICATION DE<br />

COMPOSANT ELECTRONIQUE ET<br />

COMPOSANT ELECTRONIQUE<br />

(71) THE UNIVERSITY OF LIVERPOOL<br />

[GB/GB]; Senate House, Abercromby<br />

Square, Liverpool L69 3BX (GB).<br />

(for all designated States except / pour tous<br />

les États désignés sauf US)<br />

(72, 75) ECCLESTON, William [GB/GB]; 8<br />

College Avenue, Formby, Merseyside L37<br />

3JL (GB).<br />

(74) W.P. THOMPSON & CO.; Coopers Building,<br />

Church Street, Liverpool L1 3AB (GB).<br />

(81) AE AG AL AM AT AU AZ BA BB BG BR<br />

BY BZ CA CH CN CO CR CU CZ DE DK<br />

DM DZ EC EE ES FI GB GD GE GH GM<br />

HR HU ID IL IN IS JP KE KG KP KR KZ<br />

LC LK LR LS LT LU LV MA MD MG MK<br />

MN MW MX MZ NO NZ PL PT RO RU SD<br />

SE SG SI SK SL TJ TM TR TT TZ UA UG<br />

US UZ VN YU ZA ZW.<br />

(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />

UG ZW); EA (AM AZ BY KG KZ MD RU<br />

TJ TM); EP (AT BE CH CY DE DK ES FI<br />

FR GB GR IE IT LU MC NL PT SE TR); OA<br />

(BF BJ CF CG CI CM GA GN GW ML MR<br />

NE SN TD TG).<br />

Published / Publiée :(c)<br />

(51) 7 H01L 21/336, 21/66, 21/225, 29/78, 29/06<br />

(11) WO 01/95385<br />

(21) <strong>PCT</strong>/US01/18007<br />

(13) A1<br />

(22) 1 Jun/juin <strong>2001</strong> (01.06.<strong>2001</strong>)<br />

(25) en (26) en<br />

(30) 09/586,407 2 Jun/juin 2000<br />

(02.06.2000)<br />

US<br />

(30) 09/766,229 19 Jan/jan <strong>2001</strong><br />

(19.01.<strong>2001</strong>)<br />

US<br />

(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />

(54) • METHOD OF MAKING A POWER<br />

MOSFET<br />

• PROCEDE DE FABRICATION D’UN<br />

MOSFET DE PUISSANCE<br />

(71) GENERAL SEMICONDUCTOR, INC.<br />

[US/US]; 10 Melville Park Road, Melville,<br />

NY 11747 (US).<br />

(72) BLANCHARD, Richard, A.; 10724 Mora<br />

Drive, Los Altos, CA 94024 (US).<br />

(74) MAYER, Stuart, H.; Mayer, Fortkort &<br />

Williams, Suite 2<strong>50</strong>, 200 Executive Drive,<br />

West Orange, NJ 07052 (US).<br />

(81) AE AG AL AM AT AU AZ BA BB BG BR<br />

BY BZ CA CH CN CO CR CU CZ DE DK<br />

DM DZ EE ES FI GB GD GE GH GM HR<br />

HU ID IL IN IS JP KE KG KP KR KZ LC<br />

LK LR LS LT LU LV MA MD MG MK MN<br />

MW MX MZ NO NZ PL PT RO RU SD SE<br />

SG SI SK SL TJ TM TR TT TZ UA UG UZ<br />

VN YU ZA ZW.<br />

(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />

UG ZW); EA (AM AZ BY KG KZ MD RU<br />

TJ TM); EP (AT BE CH CY DE DK ES FI<br />

FR GB GR IE IT LU MC NL PT SE TR); OA<br />

(BF BJ CF CG CI CM GA GN GW ML MR<br />

NE SN TD TG).<br />

Published / Publiée :(c)<br />

(51) 7 H01L 21/60<br />

(11) WO 01/95386<br />

(21) <strong>PCT</strong>/US01/13760<br />

(13) A2<br />

(22) 26 Apr/avr <strong>2001</strong> (26.04.<strong>2001</strong>)<br />

(25) en (26) en<br />

(30) 2000-171885 8 Jun/juin 2000<br />

(08.06.2000)<br />

JP<br />

(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />

(54) • APPARATUS AND METHOD FOR<br />

CORRECTING WARP OF SEMICON-<br />

DUCTOR CARRIER TAPE<br />

• APPAREIL<br />

CORRIGER<br />

ET<br />

LE<br />

PROCEDE POUR<br />

GAUCHISSEMENT<br />

DE BANDES DE SUPPORT DE<br />

SEMI-CONDUCTEURS<br />

(71) 3M INNOVATIVE PROPERTIES COM-<br />

PANY [US/US]; P.O. Box 33427, 3M Center,<br />

Saint Paul, MN 55133-3427 (US).<br />

(72) KAWAI, Takayuki; P.O. Box 33427, Saint<br />

Paul, MN 55133-3427 (US). OHKURA,<br />

Yoshiyuki; P.O. Box 33427, Saint Paul, MN<br />

55133-3427 (US).<br />

(74) McNUTT, Matthew, B. et al. / etc.; Office<br />

of <strong>Intellectual</strong> <strong>Property</strong> Counsel, P.O. Box<br />

33427, Saint Paul, MN 55133-3427 (US).<br />

(81) KR SG.<br />

(51) 7 H01L 21/60<br />

(11) WO 01/95387<br />

(21) <strong>PCT</strong>/US01/14761<br />

(13) A2<br />

(22) 8 May/mai <strong>2001</strong> (08.05.<strong>2001</strong>)<br />

(25) en (26) en<br />

(30) 2000-171889 8 Jun/juin 2000<br />

(08.06.2000)<br />

JP<br />

(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />

(54) • PACKAGING TOOLS AND METHOD<br />

FOR SEMICONDUCTOR CARRIER<br />

TAPE<br />

• OUTILS ET PROCEDES DE TRAI-<br />

TEMENT DE RUBAN PORTE-SEMI-<br />

CONDUCTEURS<br />

(71) 3M INNOVATIVE PROPERTIES COM-<br />

PANY [US/US]; Post Office Box 33427, 3M<br />

Center, Saint Paul, MN 55133-3427 (US).<br />

(72) OHKURA, Yoshiyuki; Post Office Box<br />

33427, Saint Paul, MN 55133-3427 (US).<br />

KAWAI, Takayuki; Post Office Box 33427,<br />

Saint Paul, MN 55133-3427 (US).<br />

(74) McNUTT, Matthew, B. et al. / etc.; Office<br />

of <strong>Intellectual</strong> <strong>Property</strong> Counsel, Post Office<br />

Box 33427, Saint Paul, MN 55133-3427<br />

(US).<br />

(81) KR SG.<br />

(51) 7 H01L 21/68, 21/66<br />

(11) WO 01/95388<br />

(21) <strong>PCT</strong>/JP01/04822<br />

(13) A1<br />

(22) 7 Jun/juin <strong>2001</strong> (07.06.<strong>2001</strong>)<br />

(25) ja (26) ja<br />

(30) 2000-170453 7 Jun/juin 2000<br />

(07.06.2000)<br />

JP<br />

(30) 2000-292837 26 Sep/sep 2000<br />

(26.09.2000)<br />

JP<br />

(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />

(54) • SUPPORTING CONTAINER AND<br />

SEMICONDUCTOR MANUFACTUR-<br />

ING AND INSPECTING DEVICE<br />

• RECIPIENT SUPPORT, FABRICATION<br />

DE SEMI-CONDUCTEURS ET DISPO-<br />

SITIF D’INSPECTION<br />

(71) IBIDEN CO., LTD. [JP/JP]; 1, Kandacho<br />

2-chome, Ogaki-shi, Gifu <strong>50</strong>3-0917 (JP).<br />

(for all designated States except / pour tous<br />

les États désignés sauf US)<br />

(72, 75) HIRAMATSU, Yasuji [JP/JP]; c/o<br />

IBIDEN CO., LTD., 1-1, Kitagata, Ibigawacho,<br />

Ibi-gun, Gifu <strong>50</strong>1-0695 (JP). ITO,<br />

Yasutaka [JP/JP]; c/o IBIDEN CO., LTD.,<br />

1-1, Kitagata, Ibigawacho, Ibi-gun, Gifu<br />

<strong>50</strong>1-0695 (JP).<br />

(74) YASUTOMI, Yasuo et al. / etc.; Chuo<br />

BLDG., 4-20, Nishinakajima 5-chome, Yodogawa-ku,<br />

Osaka-shi, Osaka 532-0011 (JP).<br />

(81) US.<br />

(84) EP (AT BE CH CY DE DK ES FI FR GB GR<br />

IE IT LU MC NL PT SE TR).<br />

(51) 7 H01L 21/761<br />

(11) WO 01/95389 (13) A2<br />

(21) <strong>PCT</strong>/US01/18153<br />

(22) 5 Jun/juin <strong>2001</strong> (05.06.<strong>2001</strong>)<br />

(25) en (26) en<br />

(30) 09/588,243 6 Jun/juin 2000 US<br />

(06.06.2000)<br />

(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />

(54) • SHIELDING OF ANALOG CIRCUITS<br />

ON SEMICONDUCTOR SUBSTRATES<br />

• BLINDAGE DE CIRCUITS ANALO-<br />

GIQUES SUR DES SUBSTRATS SEMI-<br />

CONDUCTEURS<br />

(71) INFINEON TECHNOLOGIES NORTH<br />

AMERICA CORP. [US/US]; 1730 North<br />

First Street, San Jose, CA 95112-4<strong>50</strong>8 (US).<br />

(72) PRIGGE, Odin; 22 Ervin Drive, Wappingers<br />

Falls, NY 12590 (US).<br />

(74) BRADEN, Stanton, C. et al. / etc.; Siemens<br />

Corporation - <strong>Intellectual</strong> <strong>Property</strong> Dept., 186<br />

Wood Ave. South, Iselin, NJ 08830 (US).<br />

(81) JP KR.<br />

(84) EP (AT BE CH CY DE DK ES FI FR GB GR<br />

IE IT LU MC NL PT SE TR).

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