PCT/2001/50 - World Intellectual Property Organization
PCT/2001/50 - World Intellectual Property Organization
PCT/2001/50 - World Intellectual Property Organization
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<strong>50</strong>/<strong>2001</strong><br />
23098 <strong>PCT</strong> Gazette - Section I - Gazette du <strong>PCT</strong> 13 Dec/déc <strong>2001</strong><br />
(72, 75) DELEONIBUS, Simon [FR/FR]; 40,<br />
allée des Giteaux, La Chanteraie, F-38640<br />
Claix (FR).<br />
(74) WEBER, Etienne; Brevatome, 3, rue du<br />
Docteur Lancereaux, F-7<strong>50</strong>08 Paris (FR).<br />
(81) JP US.<br />
(84) EP (AT BE CH CY DE DK ES FI FR GB GR<br />
IE IT LU MC NL PT SE TR).<br />
(51) 7 H01L 21/336, 21/768<br />
(11) WO 01/95384 (13) A1<br />
(21) <strong>PCT</strong>/GB01/02456<br />
(22) 4 Jun/juin <strong>2001</strong> (04.06.<strong>2001</strong>)<br />
(25) en (26) en<br />
(30) 0013473.4 3 Jun/juin 2000 GB<br />
(03.06.2000)<br />
(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />
(54) • A METHOD OF ELECTRONIC COM-<br />
PONENT FABRICATION AND AN<br />
ELECTRONIC COMPONENT<br />
• PROCEDE DE FABRICATION DE<br />
COMPOSANT ELECTRONIQUE ET<br />
COMPOSANT ELECTRONIQUE<br />
(71) THE UNIVERSITY OF LIVERPOOL<br />
[GB/GB]; Senate House, Abercromby<br />
Square, Liverpool L69 3BX (GB).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) ECCLESTON, William [GB/GB]; 8<br />
College Avenue, Formby, Merseyside L37<br />
3JL (GB).<br />
(74) W.P. THOMPSON & CO.; Coopers Building,<br />
Church Street, Liverpool L1 3AB (GB).<br />
(81) AE AG AL AM AT AU AZ BA BB BG BR<br />
BY BZ CA CH CN CO CR CU CZ DE DK<br />
DM DZ EC EE ES FI GB GD GE GH GM<br />
HR HU ID IL IN IS JP KE KG KP KR KZ<br />
LC LK LR LS LT LU LV MA MD MG MK<br />
MN MW MX MZ NO NZ PL PT RO RU SD<br />
SE SG SI SK SL TJ TM TR TT TZ UA UG<br />
US UZ VN YU ZA ZW.<br />
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />
UG ZW); EA (AM AZ BY KG KZ MD RU<br />
TJ TM); EP (AT BE CH CY DE DK ES FI<br />
FR GB GR IE IT LU MC NL PT SE TR); OA<br />
(BF BJ CF CG CI CM GA GN GW ML MR<br />
NE SN TD TG).<br />
Published / Publiée :(c)<br />
(51) 7 H01L 21/336, 21/66, 21/225, 29/78, 29/06<br />
(11) WO 01/95385<br />
(21) <strong>PCT</strong>/US01/18007<br />
(13) A1<br />
(22) 1 Jun/juin <strong>2001</strong> (01.06.<strong>2001</strong>)<br />
(25) en (26) en<br />
(30) 09/586,407 2 Jun/juin 2000<br />
(02.06.2000)<br />
US<br />
(30) 09/766,229 19 Jan/jan <strong>2001</strong><br />
(19.01.<strong>2001</strong>)<br />
US<br />
(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />
(54) • METHOD OF MAKING A POWER<br />
MOSFET<br />
• PROCEDE DE FABRICATION D’UN<br />
MOSFET DE PUISSANCE<br />
(71) GENERAL SEMICONDUCTOR, INC.<br />
[US/US]; 10 Melville Park Road, Melville,<br />
NY 11747 (US).<br />
(72) BLANCHARD, Richard, A.; 10724 Mora<br />
Drive, Los Altos, CA 94024 (US).<br />
(74) MAYER, Stuart, H.; Mayer, Fortkort &<br />
Williams, Suite 2<strong>50</strong>, 200 Executive Drive,<br />
West Orange, NJ 07052 (US).<br />
(81) AE AG AL AM AT AU AZ BA BB BG BR<br />
BY BZ CA CH CN CO CR CU CZ DE DK<br />
DM DZ EE ES FI GB GD GE GH GM HR<br />
HU ID IL IN IS JP KE KG KP KR KZ LC<br />
LK LR LS LT LU LV MA MD MG MK MN<br />
MW MX MZ NO NZ PL PT RO RU SD SE<br />
SG SI SK SL TJ TM TR TT TZ UA UG UZ<br />
VN YU ZA ZW.<br />
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />
UG ZW); EA (AM AZ BY KG KZ MD RU<br />
TJ TM); EP (AT BE CH CY DE DK ES FI<br />
FR GB GR IE IT LU MC NL PT SE TR); OA<br />
(BF BJ CF CG CI CM GA GN GW ML MR<br />
NE SN TD TG).<br />
Published / Publiée :(c)<br />
(51) 7 H01L 21/60<br />
(11) WO 01/95386<br />
(21) <strong>PCT</strong>/US01/13760<br />
(13) A2<br />
(22) 26 Apr/avr <strong>2001</strong> (26.04.<strong>2001</strong>)<br />
(25) en (26) en<br />
(30) 2000-171885 8 Jun/juin 2000<br />
(08.06.2000)<br />
JP<br />
(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />
(54) • APPARATUS AND METHOD FOR<br />
CORRECTING WARP OF SEMICON-<br />
DUCTOR CARRIER TAPE<br />
• APPAREIL<br />
CORRIGER<br />
ET<br />
LE<br />
PROCEDE POUR<br />
GAUCHISSEMENT<br />
DE BANDES DE SUPPORT DE<br />
SEMI-CONDUCTEURS<br />
(71) 3M INNOVATIVE PROPERTIES COM-<br />
PANY [US/US]; P.O. Box 33427, 3M Center,<br />
Saint Paul, MN 55133-3427 (US).<br />
(72) KAWAI, Takayuki; P.O. Box 33427, Saint<br />
Paul, MN 55133-3427 (US). OHKURA,<br />
Yoshiyuki; P.O. Box 33427, Saint Paul, MN<br />
55133-3427 (US).<br />
(74) McNUTT, Matthew, B. et al. / etc.; Office<br />
of <strong>Intellectual</strong> <strong>Property</strong> Counsel, P.O. Box<br />
33427, Saint Paul, MN 55133-3427 (US).<br />
(81) KR SG.<br />
(51) 7 H01L 21/60<br />
(11) WO 01/95387<br />
(21) <strong>PCT</strong>/US01/14761<br />
(13) A2<br />
(22) 8 May/mai <strong>2001</strong> (08.05.<strong>2001</strong>)<br />
(25) en (26) en<br />
(30) 2000-171889 8 Jun/juin 2000<br />
(08.06.2000)<br />
JP<br />
(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />
(54) • PACKAGING TOOLS AND METHOD<br />
FOR SEMICONDUCTOR CARRIER<br />
TAPE<br />
• OUTILS ET PROCEDES DE TRAI-<br />
TEMENT DE RUBAN PORTE-SEMI-<br />
CONDUCTEURS<br />
(71) 3M INNOVATIVE PROPERTIES COM-<br />
PANY [US/US]; Post Office Box 33427, 3M<br />
Center, Saint Paul, MN 55133-3427 (US).<br />
(72) OHKURA, Yoshiyuki; Post Office Box<br />
33427, Saint Paul, MN 55133-3427 (US).<br />
KAWAI, Takayuki; Post Office Box 33427,<br />
Saint Paul, MN 55133-3427 (US).<br />
(74) McNUTT, Matthew, B. et al. / etc.; Office<br />
of <strong>Intellectual</strong> <strong>Property</strong> Counsel, Post Office<br />
Box 33427, Saint Paul, MN 55133-3427<br />
(US).<br />
(81) KR SG.<br />
(51) 7 H01L 21/68, 21/66<br />
(11) WO 01/95388<br />
(21) <strong>PCT</strong>/JP01/04822<br />
(13) A1<br />
(22) 7 Jun/juin <strong>2001</strong> (07.06.<strong>2001</strong>)<br />
(25) ja (26) ja<br />
(30) 2000-170453 7 Jun/juin 2000<br />
(07.06.2000)<br />
JP<br />
(30) 2000-292837 26 Sep/sep 2000<br />
(26.09.2000)<br />
JP<br />
(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />
(54) • SUPPORTING CONTAINER AND<br />
SEMICONDUCTOR MANUFACTUR-<br />
ING AND INSPECTING DEVICE<br />
• RECIPIENT SUPPORT, FABRICATION<br />
DE SEMI-CONDUCTEURS ET DISPO-<br />
SITIF D’INSPECTION<br />
(71) IBIDEN CO., LTD. [JP/JP]; 1, Kandacho<br />
2-chome, Ogaki-shi, Gifu <strong>50</strong>3-0917 (JP).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) HIRAMATSU, Yasuji [JP/JP]; c/o<br />
IBIDEN CO., LTD., 1-1, Kitagata, Ibigawacho,<br />
Ibi-gun, Gifu <strong>50</strong>1-0695 (JP). ITO,<br />
Yasutaka [JP/JP]; c/o IBIDEN CO., LTD.,<br />
1-1, Kitagata, Ibigawacho, Ibi-gun, Gifu<br />
<strong>50</strong>1-0695 (JP).<br />
(74) YASUTOMI, Yasuo et al. / etc.; Chuo<br />
BLDG., 4-20, Nishinakajima 5-chome, Yodogawa-ku,<br />
Osaka-shi, Osaka 532-0011 (JP).<br />
(81) US.<br />
(84) EP (AT BE CH CY DE DK ES FI FR GB GR<br />
IE IT LU MC NL PT SE TR).<br />
(51) 7 H01L 21/761<br />
(11) WO 01/95389 (13) A2<br />
(21) <strong>PCT</strong>/US01/18153<br />
(22) 5 Jun/juin <strong>2001</strong> (05.06.<strong>2001</strong>)<br />
(25) en (26) en<br />
(30) 09/588,243 6 Jun/juin 2000 US<br />
(06.06.2000)<br />
(43) 13 Dec/déc <strong>2001</strong> (13.12.<strong>2001</strong>)<br />
(54) • SHIELDING OF ANALOG CIRCUITS<br />
ON SEMICONDUCTOR SUBSTRATES<br />
• BLINDAGE DE CIRCUITS ANALO-<br />
GIQUES SUR DES SUBSTRATS SEMI-<br />
CONDUCTEURS<br />
(71) INFINEON TECHNOLOGIES NORTH<br />
AMERICA CORP. [US/US]; 1730 North<br />
First Street, San Jose, CA 95112-4<strong>50</strong>8 (US).<br />
(72) PRIGGE, Odin; 22 Ervin Drive, Wappingers<br />
Falls, NY 12590 (US).<br />
(74) BRADEN, Stanton, C. et al. / etc.; Siemens<br />
Corporation - <strong>Intellectual</strong> <strong>Property</strong> Dept., 186<br />
Wood Ave. South, Iselin, NJ 08830 (US).<br />
(81) JP KR.<br />
(84) EP (AT BE CH CY DE DK ES FI FR GB GR<br />
IE IT LU MC NL PT SE TR).