Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Wafer Level <strong>Burn</strong>-<strong>in</strong> MethodologyPackage <strong>Burn</strong>-<strong>in</strong> / Die-Level <strong>Burn</strong>-<strong>in</strong>Wafer ProbeSacrificial Metal Wafer Level <strong>Burn</strong>-<strong>in</strong>Dic<strong>in</strong>gWLBI andDynamic <strong>Test</strong>AssemblyCarrierLoadWafer Probe(Reduced Time)<strong>Test</strong>AssemblyDic<strong>in</strong>gPackage<strong>Burn</strong>-<strong>in</strong>BCarrier<strong>Burn</strong>-<strong>in</strong><strong>Test</strong><strong>Test</strong>Packaged UnitsKGDCarrierUnloadPackaged UnitsKGD<strong>BiTS</strong> 2001 <strong>Workshop</strong>T. McKenzie / W. Ballouli / J. Stroupe7
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