Burn-in & Test Socket Workshop - BiTS Workshop

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WLBI Design Considerations● Additional scribe area to support burn-in circuitinterconnect and current limiting resistors● Proper burn-in metal width and space to supportphoto and etch process● Proper pogo pin pad size for gross waferalignmentBiTS 2001 WorkshopT. McKenzie / W. Ballouli / J. Stroupe15
WLBI Design Considerations● Minimum die per cluster defined by the number ofrequired signals, power lines, and grounds.● Metal bus width is designed to support currentdensity requirement● Proper adhesion between burn-in circuit metal andpolyimide at elevated temperature (Burn-In 125°C/Data Retention Bake 270°C)● Polyimide to support burn-in contact over activecircuit● Maintain aluminum pad integrity after burn-inmetal removalBiTS 2001 WorkshopT. McKenzie / W. Ballouli / J. Stroupe16
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3: Technical ProgramSession 8Wednesday
Page 6 and 7: KGD Sacrificial Metal WLBI• Defin
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17: 8 inch Wafer Level Burn-In SystemCu
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
Page 39 and 40: MotorolaCurrent Final Manufacturing
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45 and 46: MatsushitaIn conclusion, a first st
Page 47 and 48: FormFactorThe ultimate extension of
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51 and 52: FormFactorWLBI Clamping and Cooling
Page 53 and 54: GryphicsGryphics®, Inc.In Developm
Page 56 and 57: The following is an example ofsuch
Page 58 and 59: Aehr Test SystemsAehr Test Systems
Page 60 and 61: Aehr Test SystemsThe economics and
Page 62 and 63: Motorola Inc. / SPS GroupSacrificia
Page 64 and 65: Test System Design:Motorola Inc. /
Page 66 and 67: Fixture Design and Contact Technolo
Page 68 and 69:
Die Product ConsortiumDie Products
Page 70 and 71:
Contributors1. Flynn, Greg W., “W
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