Burn-in & Test Socket Workshop - BiTS Workshop

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Verification of Aluminum Pad IntegrityMechanical Test Engineering Wafer Control WaferBall Shear (gmf)Average 43.8 43.2High 54.3 51.3Low 31.2 36.7Std Dev 5.1 3.7Tensile Pull (gmf)Average 9.6 8.7High 11.0 10.2Low 7.6 7.3Std Dev 0.8 0.8BiTS 2001 WorkshopT. McKenzie / W. Ballouli / J. Stroupe17
System Design Considerations● Maximum wafer power dissipation undernatural and forced convection● Effect of heatsink thickness and shape● Thermal transfer between wafer and heatsink● Inlet air temperature● Airflow speed and circulation pattern● Temperature uniformity across the waferBiTS 2001 WorkshopT. McKenzie / W. Ballouli / J. Stroupe18
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3: Technical ProgramSession 8Wednesday
Page 6 and 7: KGD Sacrificial Metal WLBI• Defin
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19: WLBI Design Considerations● Minim
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
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Contributors1. Flynn, Greg W., “W
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