Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Contributors1. Flynn, Greg W., “Wafer Level <strong>Burn</strong>-In (WLBI) at Motorola -Outl<strong>in</strong>e” for Fleck Research Chip Scale International 1999.2. Mosko, John, “Full Wafer <strong>Burn</strong>-In and <strong>Test</strong>” from Sixth AnnualKGD <strong>Workshop</strong>, W.L.Gore & Associates, Inc.3. Nakata, Yoshiro and Kawai,Makoto, “A Wafer-Level <strong>Burn</strong>-<strong>in</strong>Technology” from ULSI Process Technology DevelopmentCenter, Matsushita Electronics Corporation.4. Whitten, Ralph, “Us<strong>in</strong>g Microspr<strong>in</strong>g Contacts for WaferLevel Packag<strong>in</strong>g and <strong>Test</strong>” from FormFactor, Inc.5. Rathburn, James, “In Development: Controlled ComplianceProbe with Generic Applications for Wafer Probe” fromGryphics, Inc.6. Carbone, Mark C., “Wafer Level <strong>Burn</strong>-In and <strong>Test</strong> System(WLBT)” presented at Semicon West, 1999 by Aehr <strong>Test</strong>Systems.41
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