Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Motorola Inc. / SPS GroupThe WLBI process flow at the wafer-level:! WLBI process flow is identical to packagelevel devices all the way to Metal-3 at theMOS! The special passivation mask enable contactalong the scribe grid whose contactsaccommodate excercis<strong>in</strong>g of the devicedur<strong>in</strong>g burn-<strong>in</strong>! A f<strong>in</strong>al polyimide over-layer acts as a stressbuffer <strong>in</strong> aggressive environments (ie.,automotive) - need to be free of unstablecomponents to prevent outgass<strong>in</strong>g! Wafer-level burn-<strong>in</strong> circuit removalcomprised of wet etch processes withchemistries identical to that used <strong>in</strong> def<strong>in</strong><strong>in</strong>gthe WLBI circuit - TiW and/or Cu must becompletely removed34