Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Became nucleus for such KGD socket/carriertechnologies as:T.I./M.M.S.’s DieMate® - Aehr<strong>Test</strong>’s DiePak®Yamaichi’s KGD/Gold Dot® Program- Bear Technology/Micron Technology - EPITechnologies EPIK® SystemChip Supply’s TAB system - etc.! Goal of these technologies was to get KGD(test & burn-<strong>in</strong>) down to less than $0.01/p<strong>in</strong>= about parity with that of typical TSOPmemory package.Never reached that goal for numerousreasons:! ‘Handl<strong>in</strong>g’ (load<strong>in</strong>g/unload<strong>in</strong>g) of s<strong>in</strong>gulatedbare die <strong>in</strong> carriers proved too cumbersomeand unwieldy6
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